Rockwell International Corporation

Emory R Walton, Jr

J Aiden Higgins

A miniaturized probe is provided for making contact with test probe pads on an integrated circuit. The probe tips are precisely positioned on the underside of a microwave substrate board. Short wires extend through a hole in the insulating board and connect the probe tips to a conductive line on the topside of the microwave substrate board. The wires are imbedded in a potting compound which also holds the probe tips. Precise location of the probe tips is accomplished during fabrication of the probe by using depressions etched in a substrate as a mold and depositing metal in these depressions using photoresist and deposition techniques.

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Thousand Oaks, CA, United States of America

Emory R Walton, Jr