Motorola Corporation

Arizona State University

Emmett Howard

Kenneth Andrew Dean

Nicholas Munizza

Bernard F Coll

Paul Yee

Douglas E Loy

James E Jaskie

Curtis D Moyer

Lawrence N Dworsky

Joseph T Smith

Joyce K Yamamoto

Michael Marrs

Jennifer M Blain Christen

Zachary Hartke

Albert Alec Talin

William J Dauksher

Robert H Reuss

John Song

Michael R Johnson

Donald F Weston

Thomas Nilsson

Jesmin Haq

Dirk C Jordan

Yong-Kyun Lee

Lyndee L Tisinger

Joseph Justin Bonanno

David Morton

Some embodiments include a method. The method can include: providing a carrier substrate; providing a bond promoting layer over the carrier substrate; and depositing a first device substrate over the carrier substrate and the bond promoting layer. The first device substrate can be configured to bond to the carrier substrate with a first device substrate-carrier substrate adhesion strength. Meanwhile, depositing the first device substrate can include: bonding the first device substrate to the bond promoting layer, the first device substrate bonding to the bond promoting layer with a first device substrate-bond promoting layer adhesion strength greater than the first device substrate-carrier substrate adhesion strength; and coupling the first device substrate to the carrier substrate. Other embodiments of related methods and devices are also disclosed.

Method of providing an electronic device and electronic device thereof

Some embodiments include a method. The method can include: providing a carrier substrate; providing a first bond promoting layer over the carrier substrate; providing a second bond promoting layer over the carrier substrate; and depositing a first device substrate over the carrier substrate, the first bond promoting layer, and the second bond promoting layer. The first device substrate can be configured to bond to the carrier substrate with a first device substrate-carrier substrate adhesion strength. Meanwhile, depositing the first device substrate can include: bonding the first device substrate to the first bond promoting layer, the first device substrate bonding to the first bond promoting layer with a first device substrate-first bond promoting layer adhesion strength greater than the first device substrate-carrier substrate adhesion strength; and coupling the first device substrate to the carrier substrate. Other embodiments of related methods and devices are also disclosed.

Some embodiments include a method of providing an electronic device. The method can comprise: providing a first device substrate; providing one or more first active sections over a second side of the first device substrate at a first device portion of the first device substrate; and after providing the first active section(s) over the second side of the first device substrate at the first device portion, folding a first perimeter portion of the first device substrate toward the first device portion at a first side of the first device substrate so that a first edge portion remains to at least partially frame the first device portion. The first edge portion can comprise a first edge portion width dimension smaller than a first smallest cross dimension of one or more pixel(s) of one or more semiconductor device(s) of the first active section(s). Other embodiments of related methods and devices are also disclosed.

Electronic device and methods of providing and using electronic device

Some embodiments include a method. The method can comprise: providing a carrier substrate; providing an adhesion modification layer over the carrier substrate; providing a device substrate; and coupling the device substrate and the carrier substrate together, the adhesion modification layer being located between the device substrate and the carrier substrate when the device substrate and the carrier substrate are coupled together. In these embodiments, the adhesion modification layer can be configured so that the device substrate couples indirectly with the carrier substrate by way of the adhesion modification layer with a first bonding force that is greater than a second bonding force by which the device substrate couples with the carrier substrate absent the adhesion modification layer. Other embodiments of related methods and devices are also disclosed.

Method of providing a flexible semiconductor device and flexible semiconductor device thereof

Some embodiments include a method. The method can include providing a carrier substrate, providing a release layer over the carrier substrate, and providing a device substrate over the carrier substrate and the release layer. Providing the device substrate can include bonding the device substrate to the carrier substrate, and bonding the device substrate to the release layer. Further, providing the release layer can include bonding the release layer to the carrier substrate. Meanwhile, the release layer can include polymethylmethacrylate, and the device substrate can be bonded to the carrier substrate with a first adhesion strength, the device substrate can be bonded to the release layer with a second adhesion strength less than the first adhesion strength, and the release layer can be bonded to the carrier substrate with a third adhesion strength greater than the second adhesion strength. Other embodiments of related methods and devices are also disclosed.

Some embodiments include a method of providing an electronic device. The method includes: (i) providing a carrier substrate, (ii) providing a device substrate comprising a first side and a second side opposite the first side, the device substrate having a flexible substrate, (iii) coupling the first side of the device substrate to the carrier substrate; and (iv) after coupling the first side of the device substrate to the carrier substrate, providing two or more active sections over the second side of the device substrate, each active section of the two or more active sections being spatially separate from each other and having at least one semiconductor device. Other embodiments of related methods and devices are also disclosed.

Deformable electronic device and methods of providing and using deformable electronic device

Some embodiments include a method. The method can include providing a carrier substrate having an edge. Further, the method can include providing a cross-linking adhesive, and providing a flexible substrate having an edge. Further still, the method can include coupling the flexible substrate to the carrier substrate using the cross-linking adhesive such that at least a portion of the edge of the flexible substrate is recessed from the edge of the carrier substrate and such that the cross-linking adhesive has an exposed portion of the cross-linking adhesive at an offset portion of the first surface of the carrier substrate between the at least the portion of the edge of the flexible substrate and the edge of the carrier substrate. Meanwhile, the method can include etching the exposed portion of the cross-linking adhesive. Other embodiments of related methods and devices are also disclosed.

Some embodiments can include a method of manufacturing first electronic device(s) and second electronic device(s), the method including: providing a carrier substrate having a first side and a second side, a first substrate bonded to the first side of the carrier substrate, and a second substrate bonded to the second side of the carrier substrate; depositing at least one layer of a first material over the first substrate while the first substrate is bonded to the first side of the carrier substrate to create a portion of the first electronic device(s); and depositing at least one layer of a second material over the second substrate while the second substrate is bonded to the second side of the carrier substrate to create a portion of the second electronic device(s). In many embodiments, the first substrate and/or the second substrate includes a flexible substrate. Other related systems and methods are also disclosed.

Method of manufacturing electronic devices on both sides of a carrier substrate and electronic devices thereof

In some embodiments, a method of manufacturing electronic devices including providing a carrier substrate having a first side, a second side, and a first adhesive at the first side; providing a first flexible substrate; and bonding the first flexible substrate to the first side of the carrier substrate. The first adhesive bonds the first flexible substrate to the first side of the carrier substrate. The carrier substrate comprises a mechanism configured to compensate for a deformation of the carrier substrate. Other embodiments are disclosed.

Method for manufacturing electronic devices and electronic devices thereof

A method is provided for preventing electron emission from a sidewall () of a gate electrode () and the edge () of the gate electrode stack of a field emission device (), the gate electrode () having a surface () distally disposed from an anode () and a side () proximate to emission electrodes (). The method comprises growing dielectric material () over the surface () and side () of the gate electrode (), and performing an anisotropic etch () normal to the surface () to remove the dielectric material () from the surface () and leaving at least a portion of the dielectric material () on the side () of the gate electrode () and edge () of the gate electrode stack.

Method for preventing electron emission from defects in a field emission device

A field emission device () is provided that prevents electrical breakdown. The field emission device () comprises an anode () distally disposed from a cathode plate that includes an insulating substrate () having a portion exposed to the anode (), and a cathode metal () overlying another portion of the insulating substrate (). A gate electrode () overlies an oxide () above at least a portion of the cathode metal () and optionally above a portion of the substrate. A dielectric layer () is positioned between a resistive layer () and the cathode metal (), and substantially all of the exposed substrate, and underlies substantially all of the gate electrode () including its edges (), providing a resistance between the cathode metal () and the edges ().

Field emission device

An apparatus for focusing electrons being emitted from a field emission device comprises a cathode metal layer () formed over a first portion of a substrate () to partially define a sidewall () for a trench () in a second portion of the substrate. A ballast layer () is formed over the second portion, the cathode metal layer (), and the sidewall (). A first dielectric layer () is formed over the ballast layer () in the first portion and a gate extraction metal layer () is formed thereover. At least one emitter () is formed above the substrate and in the trench () having the sidewall () defined by the first dielectric layer () and the cathode metal layer (). The ballast layer () extends along the sidewall and conductively contacts the cathode metal layer and the at least one emitter and provides a force that counteracts the sidewise pull of the gate extraction metal layer ().

Field emission display with electron trajectory field shaping

A process for forming a catalyst layer for carbon nanotube growth comprising forming a catalyst layer having a first and second portion over one of a cathode metal layer or a ballast resistor layer; patterning a photoresist over the first portion; etching the second portion with a chlorine/argon plasma; removing the photoresist with an ash process; and removing the veils and preparing the surface for carbon nanotube growth with a semi-aqueous hydroxylamine solution.

Plasma etch process for defining catalyst pads on nanoemissive displays

A fabrication process is provided for reducing leakage current in a field emission display having at least one electron emitter () electrically coupled to a ballast resistor () coupled to a cathode metal (), wherein at least one defect () extends to a gate electrode () from a region () electrically coupled to the ballast resistor, the method comprising heating () to reduce the resistance of the ballast resistor; and applying () a voltage between the cathode metal and the gate electrode thereby creating a current through the at least one defect to create an electrical open therein.

Method for reducing leakage current in a vacuum field emission display

An apparatus is provided for reducing color bleed in a flat panel display. The apparatus comprises an anode () with a plurality of phosphors () of at least two colors sequentially disposed thereon. A cathode () is arranged in parallel opposed position to and separated from the anode () and contains a plurality of pads () of emitters. Each pad () is disposed on the cathode () in spaced relationship to and aligned with one of the at least two colors, respectively, wherein electrons from each of the plurality of pads of emitters that drift from its intended phosphor () are encouraged to drift toward an adjacent phosphor () of the same color.

Growing community of inventors

Gilbert, AZ, United States of America

Emmett Howard