Imec

Katholieke Universiteit Leuven, Ku Leuven R&d

Imec Vzw

Interuniversitair Micro-elektronica Centrum Vzw

Emmanuel Van Kerschaver

Jozef Szlufcik

Guy Beaucarne

Johan F Nijs

Christophe Allebé

Frederic Dross

Frédéric Dross

Roland Einhaus

A method is provided for producing a thin substrate with a thickness below 750 microns, comprising providing a mother substrate, the mother substrate having a first main surface and a toughness; inducing a stress with predetermined stress profile in at least a portion of the mother substrate, said portion comprising the thin substrate, the induced stress being locally larger than the toughness of the mother substrate at a first depth under the main surface; such that the thin substrate is released from the mother substrate, wherein the toughness of the mother substrate at the first depth is not lowered prior to inducing the stress. The method can be used in the production of, for example, solar cells.

Method for the production of thin layer of silicon by utilization of mismatch in coefficient of thermal expansion between screen printed metal layer and silicon mother substrate

Method for the production of thin substrates

A method of etching a semiconductor substrate is described, the method comprising the steps of applying a paste containing an etchant to the substrate, and carrying out a thermal processing step to etch a part or a layer of the substrate where the paste has been applied. The etchant paste is preferably a caustic etching paste. The etchant paste may be applied selectively to a major surface of the substrate to form a pattern of applied paste. For example, the paste may be applied by a printing method, such as screen-printing. The method may be used to produce solar cells.

Semiconductor etching paste and the use thereof for localized etching of semiconductor substrates

The solar cell in the semiconductor substrate includes at least a radiation receiving front surface and a second surface. The substrate includes a first region of one type of conductivity and a second region of the opposite conductivity type with at least a first part located adjacent to the front surface and a second part located adjacent to the second surface. The front surface includes conductive contacts to the second region and the second surface has separated contacts to the first region and to the second region. The contacts to the second region at the second surface are connected to the contacts at the front surface through a limited number of vias.

Solar cell and process of manufacturing the same

Growing community of inventors

Wezemaal, Belgium

Emmanuel Van Kerschaver