Commissariat &#xc0; L'&#xc9;nergie Atomique Et Aux &#xc9;nergies Alternatives

Centre National De La Recherche Scientifique

Emmanuel Marcault

Jean-Charles Cigna

Sarah Soulie

David Tremouilles

An assembly includes power modules, each power module having at least a first and a second component disposed one on top of the other on either side of the substrate. Each component has at least two power contacts. A first connection element is electrically connected to a first power contact of the first component and to a first power contact of the second component, a second connection element is electrically connected to a second power contact of the first component, and a third connection element is electrically connected to a second power contact of the second component. The first connection elements of the modules are disposed on the same side of the assembly, the second connection elements of the modules are disposed on the same side of the assembly, and the third connection elements of the modules are disposed on the same side of the assembly.

Assembly of semiconductor power modules

A method for encapsulating an integrated circuit includes: forming first and second electrically insulating supports each having a planar surface, so as to form a recess in the first support with respect to its planar surface, and so as to form, with respect to the planar surface of each of the first and second supports, first and second reliefs, so that the first and second reliefs of the supports interact; forming a first electrical contact in the recess; positioning a chip in the recess; forming a second electrical contact on the second carrier; and superposing the first and second carriers so as to superpose their reliefs.

Growing community of inventors

La Bazoche-Gouet, France

Emmanuel Marcault