Cellink Corporation

Emily Hernandez

Kevin Michael Coakley

Malcolm Parker Brown

Will Findlay

Peter Stone

Jose Juarez

Vidya Viswanath

Joseph Pratt

Mark Terlaak

Malcom Parker Brown

Described herein are circuit assemblies comprising flexible interconnect circuits and/or other components connected to these circuits. In some examples, conductive elements of different circuits are connected with support structures, such as rivets. Furthermore, conductive elements of the same circuit can be interconnected. In some examples, a conductive element of a circuit is connected to a printed circuit board (or other devices) using a conductor joining structure. Interconnecting different circuits involves stacking these circuits such that the conductive element in one circuit overlaps with the conductive element in another circuit. A support structure protrudes through both conductive elements and any other components positioned in between, such as dielectric and/or adhesive layers. This structure electrically connects the conductive elements and also compresses the conductive elements toward each other. For example, a rivet is used with the rivet heads contacting one or two conductive elements, e.g., directly interfacing their outer-facing sides.

Forming connections to flexible interconnect circuits

Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.

Flexible hybrid interconnect circuits

Provided are multilayered flexible battery interconnects for interconnecting batteries in battery packs and methods of fabricating thereof. A multilayered flexible battery interconnect comprises insulating layers and two conductive layers, stacked together and positioned between the insulating layers. One conductive layer is thicker than the other. The thinner conductive layer comprises flexible tabs for connecting to batteries and, in some examples, comprises voltage sense traces. The smaller thickness of these flexible tabs ensures welding quality and allows using less energy during welding. The battery cell contacts, to which these flexible tabs are welded, can be significantly thicker. Furthermore, the smaller thickness enables fusible link integration into flexible tabs. At the same time, the two conductive layers collectively conduct current within the interconnect, with the thicker layer enhancing the overall current-carrying capacity. The two conductive layers can be welded together to ensure electric connections and mechanical support.

Multilayered flexible battery interconnects and methods of fabricating thereof

A connector for connecting a flexible interconnect circuit includes a base, having a first set of protrusions and a second set of protrusions. The first set of protrusions and the second set of protrusions are configured to secure the flexible interconnect circuit at a first set of apertures and a second set of apertures of the flexible interconnect circuit, respectively. The first set of protrusions may be positioned at a first distance from the second set of protrusions on the base. The first set of apertures may be positioned on the flexible interconnect circuit at a second distance, greater than the first distance, from the second set of apertures. The base causes the flexible interconnect circuit into an arched configuration when the apertures are secured to the respective protrusions. The connector further includes a cover piece configured to secure the flexible interconnect circuit in the arched configuration.

Methods and systems for terminal-free circuit connectors and flexible multilayered interconnect circuits

Described herein are circuit assemblies comprising flexible interconnect circuits and/or other components connected to these circuits. In some examples, conductive elements of different circuits are connected with support structures, such as rivets. Furthermore, conductive elements of the same circuit can be interconnected. In some examples, a conductive element of a circuit is connected to a printed circuit board (or other devices) using a conductor-joining structure. Interconnecting different circuits involves stacking these circuits such that the conductive element in one circuit overlaps with the conductive element in another circuit. A support structure protrudes through both conductive elements and any other components positioned in between, such as dielectric and/or adhesive layers. This structure electrically connects the conductive elements and also compresses the conductive elements toward each other. For example, a rivet is used with the rivet heads contacting one or two conductive elements, e.g., directly interfacing their outer-facing sides.

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Belmont, CA, United States of America

Emily Hernandez