Sandisk Technologies Inc.

Sandisk Corporation

Western Digital Technologies, Inc.

Emilio Yero

Yan Li

Dana Lee

Hem P Takiar

Jianmin Huang

Steven Theodore Sprouse

Chris Avila

Yichao Huang

Gokul Kumar

Michael Mostovoy

Jongmin Park

Steve Choi

Jiang Yin

A semiconductor device is disclosed including an integrated memory module. The integrated memory module may include a pair of semiconductor die, which together, operate as a single, integrated flash memory. In one example, the first die may include the memory cell array and the second die may include the logic circuit such as CMOS integrated circuits. In one example, the second die may be flip-chip bonded to the first die. The flip-chip bond pads on the first and second dies may be made small, with a small pitch, to allow a large number of electrical interconnections between the first and second semiconductor dies.

Manufacturing process for separating logic and memory array

Techniques and circuitry are presented for more rapidly and accurately obtaining a temperature code (TCO) on an integrated circuit. A comparison voltage is ramped up and two counts are determined concurrently, a first count on how many clock cycles for the comparison voltage to ramp up from a low reference voltage to a proportional to absolute temperature (PTAT) and a second count for the number of clock cycles for the comparison voltage to go from the low reference voltage to a high reference voltage. The TCO value is then obtained by using the second count in a post-processing calibration to adjust the first count. An initial calibration can also be included when the circuit is powered up.

Temperature code circuit with single ramp for calibration and determination

A system for programming non-volatile storage is proposed that reduces the impact of interference from the boosting of neighbors. Memory cells are divided into two or more groups. In one example, the memory cells are divided into odd and even memory cells; however, other groupings can also be used. Prior to a first trigger, a first group of memory cells are programmed together with a second group of memory cells. Subsequent to the first trigger and prior to a second trigger, the first group of memory cells are programmed separately from the second group of memory cells. Subsequent to the second trigger, the first group of memory cells are programmed together with the second group of memory cells. Before and after both triggers, the first group of memory cells are verified together with the second group of memory cells.

Reducing the impact of interference during programming

During a programming data transfer process in a non-volatile storage system, recording units of data are transferred from a host to a memory device, such as a memory card. For each recording unit, pages of data are arranged in an order such that a page which takes longer to write to a memory array of the memory device is provided before a page which takes less time to write. Overall programming time for the recording unit is reduced since a greater degree of parallel processing occurs. While the page which takes longer to program is being programmed to the memory array, the page which takes less time to program is being transferred to the memory device. After programming is completed, the memory device signals the host to transfer a next recording unit. The pages of data may include lower, middle and upper pages.

Optimized page programming order for non-volatile memory

Methods and circuitry are present for improving performance in non-volatile memory devices by allowing the inter-phase pipelining of operations with the same memory, allowing, for example, a read operation to be interleaved between the pulse and verify phases of a write operation. In the exemplary embodiment, the two operations share data latches. In specific examples, at the data latches needed for verification in a multi-level write operation free up, they can be used to store data read from another location during a read performed between steps in the multi-level write. In the exemplary embodiment, the multi-level write need only pause, execute the read, and resume the write at the point where it paused.

Use of data latches in cache operations of non-volatile memories

A hot count records the number of erase operations experienced by a block. The hot count is stored in an overhead data area of the block and is updated by circuits located on the same substrate as the block. Where a memory has two or more planes, each plane has circuits for updating hot counts.

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Sunnyvale, CA, United States of America

Emilio Yero