Google Inc.

Emil Rahim

Ihab A Ali

Chintan Trehan

Arun Prakash Raghupathy

Phanindraja Ancha

Neha Ravi Dixit

Philip Hobson Boothby

Kristen Rebecca Pownell

Jeffrey Kevin Tu

Wilson Tang

Truong Ho Cong

Joshua Moore

Systems and methods for thermal management in wearable computing devices are provided. Thermal management strategies included in the wearable computing device provide for dissipation of heat generated by electronic components installed within enclosures, or housings, of the wearable computing devices to maintain operability of the electronic components, maintain functionality and/or operability of the wearable computing device, and maintain user comfort while the wearable computing device is worn. The enclosure includes a multilayered stack of materials including a thermal layer embedded within insulating layers. The thermal layer may be shaped so as to direct the spreading of heat in a desired direction, to maintain surface touch temperatures within allowable ranges, and maintain internal enclosure temperatures within operating ranges of the electronic components.

Thermal management for head mounted wearable device

The present disclosure describes thermal mitigation for an electronic speaker device and associated systems and methods. The thermal mitigation includes monitoring several thermal zones to determine or estimate thermal conditions in corresponding parts of the electronic speaker device. The thermal zones may include a System-on-Chip (SoC) integrated circuit (IC) component, audio components including power-dissipating IC components, and a temperature of an exterior surface of a housing component of the electronic speaker device. To mitigate thermal runaway, different throttling schemes may be triggered based on the thermal zones exceeding certain thermal limits. The throttling schemes may include reducing the amount of power supplied to the SoC, reducing audio power of the audio components to a lower wattage, or manipulating SoC cores such as by disabling one or more of the cores or adjusting utilization of the SoC cores.

Thermal mitigation for an electronic speaker device and associated apparatuses and methods

This application is directed to a method for correct temperature measurement. An electronic device includes a temperature sensor that measures an ambient temperature of an environment and a display that is driven by a display driver. The electronic device determines a brightness setting of the display, estimates a display driver current based on the brightness setting, estimates a driver efficiency of the display driver based on the display driver current, and combines a predetermined display driver voltage, the display driver current, and the driver efficiency to determine a power consumption of the display driver. An ambient temperature correction is determined in accordance with the determined power consumption of the display driver, and the measured ambient temperature is thereby corrected using the ambient temperature correction. In some implementations, a power consumption of a distinct heat-generating electronic component is also monitored for adjusting the ambient temperature correction.

Power monitoring for correcting ambient temperature measurement by electronic devices

This document describes a passive thermal-control system that can be integrated into an electronic speaker device and associated electronic speaker devices. The passive thermal-control system uses an architecture that combines heat spreaders and thermal interface materials to transfer heat from heat-generating electronic devices of the electronic speaker device to a housing component of the electronic speaker device. The housing component dissipates the heat to prevent a thermal runaway condition.

Passive thermal-control system of an electronic speaker device and associated electronic speaker devices

The present document describes a passive thermal-control structure for speakers and associated apparatuses and methods. The architecture of the passive thermal-control structure is such that heat is transferred from electronic subsystems of the electronic speaker device to the passive thermal-control structure, which acts as an internal, structural frame of the electronic speaker device and provides both thermal mitigation and structural stability. The passive thermal-control structure conducts heat from the electronic subsystems to a housing of the electronic speaker device. The housing of the electronic speaker device may dissipate the heat to the ambient environment to prevent thermal runaway of the electronic subsystems, and the internal frame mitigates the temperature of the housing from exceeding ergonomic temperature limits.

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San Jose, CA, United States of America

Emil Rahim