Odelo Gmbh

Other

Lumination LLC

Gelcore, LLC

Emil P Stefanov

Ivan Eliashevich

Andreas Erber

Stephanie Specht

Hari S Venugopalan

Boris Kolodin

Bryan S Shelton

Thomas Luce

Otto Müller

Jochen Kunze

Veit Schwegler

Dagmar Wurtenberger

The invention concerns a light unit with at least one LED, which includes at least one light-emitting chip as light source, with at least one fiber-optic element optically connected after the light-emitting diode and widening in the light propagation direction, and with a secondary lens optically connected after the fiber-optic element, in which oppositely arranged surfaces bordering the fiber-optic element, which form a bottom surface and a cover surface in a longitudinal section intersecting these surfaces, have oppositely curved curve sections adjacent to the light entry surface, as well as such a fiber-optic element. A light unit with high light output requiring limited space is developed with the present invention.

Headlight assembly for a motor vehicle

The invention relates to a low beam headlight with at least one light module. The individual light module exhibits at least one light source and at least one primary lens connected downstream of the light source; and the light source is a luminescent diode. In addition, the low beam headlight has at least one secondary lens, which is connected optically downstream of the primary lens or the primary lenses. Both the primary and the secondary lens exhibit at least two lens segments, which are arranged one over the other. In addition, at least one lens segment of the primary lens and its assigned lens segment of the secondary lens lie outside the optical axis of the light module. The present invention develops a compact low beam headlight, whose light distribution has a clearly defined hot spot. The light intensity of the illumination decreases steadily in the direction of the basic distribution.

Headlight assembly

The invention concerns a light guide element whose cross-sectional surface widens continuously at least in areas from a light inlet surface to a light outlet surface, as well as a light unit with at least one LED as light source and with a light guide element. For this purpose the light guide element includes at least one area with a curved directrix, in which the curvature of the directrix in this area is constant or which the curvature of the directrix in this area diminishes with increasing cross section of the light guide element. With the present invention the light guide element and a light unit are developed, which permits a soft transition of illumination intensity in a sharply delimited light-dark boundary of the illuminated area on the other edges.

Light guide element and light unit with light guide element

In a method for fabricating a flip-chip light emitting diode device, epitaxial layers () are deposited on a growth substrate () to produce an epitaxial wafer. A plurality of light emitting diode devices are fabricated on the epitaxial wafer. The epitaxial wafer is diced to generate a device die (). The device die () is flip chip bonded to a mount (). The flip chip bonding includes securing the device die () to the mount () by bonding at least one electrode () of the device die () to at least one bonding pad () of the mount (). Subsequent to the flip chip bonding, a thickness of the growth substrate () of the device die () is reduced.

Flip chip light emitting diode devices having thinned or removed substrates

The invention relates to a lighting unit having at least one light source and at least one light guide following the source and at least partially surrounding it, said light guide including at least one light exit surface facing away from the source and at least approximately located centrally, surrounded by at least one externally located light exit surface. In addition, at least one externally located light exit surface comprises a plurality of surface elements adjacent to each other with or without offset. These surface elements are surface regions of curved solids. With the present invention, a compact lighting unit is developed that makes possible a uniformly high yield in a preassigned target region.

Lighting unit having a plurality of curved surface elements

A light guide assembly includes a base and a light source that are removably secured to the base. The light source is oriented to emit light out and away from the base. A light distributor is spaced apart from the light source and distributes the light across the light guide assembly. The light distributor includes a primary reflection surface with a plurality of transmission elements extending out from the primary reflection surface therealong to allow a portion of the light to pass through the transmission elements of the primary reflection surface without being reflected by the primary reflection surface. This facilitates the creation of a uniform beam of light being emitted by the light guide assembly.

Modular surface light guide

A light assembly disperses light emitted by a light source. The lighting assembly includes a light entry surface for receiving the light emitted by the light source. A direction surface directs the light in a predetermined direction. A stepped region, disposed adjacent the light entry surface receives the light directed by the direction surface and reflects the light. The stepped region includes a plurality of step parts, each defining a light deflection surface, wherein each of the light deflection surfaces is greater in area s step distance between the light deflection surface and the direction surface increases.

Light module with rearside introduction of light for simulation and/or as supplement of conventional light piping rods

A flip chip light emitting diode () includes a light-transmissive substrate () with a base semiconducting layer () disposed thereupon. A conductive mesh () is disposed on the base semiconducting layer () and is in electrically conductive contact therewith. Light-emitting micromesas () are disposed in openings () of the conductive mesh (). Each light emitting micromesa () has a topmost layer () of a second conductivity type that is opposite the first conductivity type. A first conductivity type electrode () is disposed on the base semiconducting layer () and is in electrical communication with the electrically conductive mesh (). An insulating layer () is disposed over the electrically conductive mesh (). A second conductivity type electrode layer () is disposed over the insulating layer () and the light-emitting micromesas (). the insulating layer () insulates the second conductivity type electrode layer () from the electrically conductive mesh ().

Growing community of inventors

Altbach, Germany

Emil P Stefanov