Sony Corporation

Emiko Sekimoto

Yukinobu Wataya

To enable to downsize a package for containing a solid-state imaging element relative to a solid-state imaging element having the same size and accordingly, downsize a solid-state imaging device for containing the solid-state imaging element thereto, further, downsize an apparatus such as a video camera or a still camera using the solid-state imaging device, there is provided a package for containing semiconductor element comprising a package having a recess portion for containing a semiconductor element, and a pair of positioning holes and a pair of attaching holes respectively provided at a pair of opposed side portions of the recess portion at surfaces of the package, wherein a line connecting the pair of positioning holes and a line connecting the pair of attaching holes are intersected with each other substantially at a center of the package.

Semiconductor device and package for containing semiconductor element

A pilot opening to the outside is formed at one side end of a package for a solid-state image-pickup device and a guide opening to the outside is formed at a side end opposite to and approximately in parallel with the one side end of the package. The pilot is made to face a pilot pin projecting above a circuit board and a guide pin is inserted into the guide. The solid-state image-pickup device is then fixed at a prescribed position on the circuit board after the pilot comes into contact with the pilot pin. With a solid-state-,image-pickup device and a mounting method thus provided, package size does not become large and mounting is carried out with an extremely high positioning precision.

Growing community of inventors

Kanagawa, Japan

Emiko Sekimoto