Hitachi Chemical Company, Ltd.

Emiko Oota

Yasuharu Murakami

Masahiko Ebihara

Hiroshi Yamazaki

Hiroyuki Tanaka

Ken Sawabe

Yukiko Muramatsu

Shota Okade

Sanchoru Ri

A laminate which includes a substrate, conductive fibersand a resin layer, wherein, in said laminate, a ratio of increase in resistance after irradiation with light emitted from a xenon lamp at an intensity of 60 W/m(integrated value of spectral irradiance at a wavelength of 300 nm to 400 nm) for 300 hours is 20% or less.

Laminate containing conductive fiber, photosensitive conductive film, method for producing conductive pattern, conductive pattern substrate, and touch panel

A photosensitive resin composition includes (A) a binder polymer having a structural unit derived from a hydroxyalkyl (meth)acrylate ester having a hydroxyalkyl group having from 1 to 12 carbon atoms, and a structural unit derived from a (meth)acrylic acid; (B) a photopolymerizable compound having an ethylenically unsaturated bond group; (C) a photopolymerization initiator; and (D) a styryl pyridine represented by the Formula (1). In Formula (1), each of R, Rand Rindependently represents an alkyl group having from 1 to 20 carbon atoms, an alkoxy group having from 1 to 6 carbon atoms, an alkyl ester group having from 1 to 6 carbon atoms, an amino group, an alkyl amino group having from 1 to 20 carbon atoms, a carboxy group, a ciano group, a nitro group, an acetyl group or a (meth)acryloyl group, each of a, b and c independently represents an integer of from 0 to 5. In a case in which each of a, b and c is independently 2 or more, the plural Rs, Rs, and Rs independently may be the same or different. 

Photosensitive resin composition, photosensitive element, method for producing substrate with resist pattern, and method for producing printed wiring board

The conductive pattern formation method according to the present invention comprises a step of providing a photosensitive conductive film including a conductive layer containing conductive fibers, a photosensitive resin layer containing a photosensitive resin and an inorganic filler, and a support film in this order, and laminating the conductive layer and the photosensitive resin layer on a base material such that the conductive layer side is closely bonded to the base material, and a step of exposing and developing the photosensitive resin layer and the conductive layer on the base material to form a conductive pattern.

Photosensitive conductive film, conductive pattern formation method using same,  and conductive pattern substrate

A photosensitive conductive film includes: a support film; and a photosensitive layer which is provided on the support film, wherein the photosensitive layer contains a plurality of conductive fibers, and an average value of the shortest distances between each of the conductive fibers and the surface at the side of the support film of the photosensitive layer is 0.1 to 50 nm.

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Tokyo, Japan

Emiko Oota