Tdk Corporation

Epcos Ag

Snaptrack Incorporated

Emi Ninomiya

Hisashi Kobuke

Yousuke Futamata

Hiroshi Yamada

Katsuhiko Igarashi

[Problem] The aim of the present invention lies in providing a glass ceramic sintered compact in which dielectric loss in a high-frequency region is reduced, without any reduction in sintering density, and also in providing a wiring board employing same. [Solution] A glass ceramic sintered compact containing a glass component, a ceramic filler and a composite oxide, characterized in that the glass component is crystallized glass on which is deposited a diopside oxide crystal phase including at least Mg, Ca and Si, and the composite oxide includes at least Al and Co.

Glass ceramic sintered compact and wiring board

A multilayer wiring substrate includes a number of insulating layers, each insulating layer including a glass ceramic. A number of internal conductor layers are formed between the insulating layers. Via conductors penetrate through the insulating layers and mutually connect the internal conductor layers in different layer locations. Surface conductor layers are formed on an outer surfaces in a lamination direction of the insulating layers. The insulating layers include outside insulating layers and inside insulating layers. A first aspect ratio representing an oblateness and sphericity of an external filler contained in the outside insulating layers is larger than a second aspect ratio representing an oblateness and sphericity of an internal filler contained in the inside insulating layers. A thermal expansion coefficient of the outside insulating layers is smaller than a thermal expansion coefficient of the inside insulating layers.

Multilayer wiring substrate

To provide a thermal head which provides an excellent adhesion between the common electrode and the heat element, and in which the content of Pb is sufficiently reduced. A thermal head, comprising a substrate, a glaze layerprovided on the substrate, a common electrodeprovided on the glaze layer, a heat elementprovided on the common electrodeand the glaze layer, and lead electrodesandprovided on the heat element, wherein the common electrodeincludes an electrically conductive material composed of metal and a glass frit, and the glass frit contains 15 to 35% by mass of ZnO, 14 to 34% by mass of SiO, 2 to 25% by mass of AlO, 2 to 15% by mass of TiO, 5 to 25% by mass of CaO, and 7 to 27% by mass of BaO.

Growing community of inventors

Tokyo, Japan

Emi Ninomiya