Shibaura Mechatronics Corporation

Shin-etsu Engineering Co., Ltd.

Emi Matsui

Konosuke Hayashi

Takashi Ootagaki

Katsuhiro Yamazaki

Yoshikazu Ohtani

Kyouhei Tomioka

Shunya Kubota

Takahiro Kanai

According to one embodiment, a substrate processing apparatus and a substrate processing method that can improve the quality of substrates are provided. The substrate processing apparatus according to one embodiment includes: a tableconfigured to support a processing target W including a substrate W, a ring Wsurrounding a surrounding of the substrate W, and a dicing tape Wadhered to a lower surface of the substrate Wand a lower surface of the ring W, and a liquid supplierconfigured to eject a liquid which does not mix with a processing liquid for processing the substrate Wand which has a specific gravity heavier than the processing liquid to one of an upper surface of the ring Wof the processing target W supported by the tablerotating by the rotation mechanism, an outer circumference end portion of the substrate Wof the processing target W supported by the tablerotating by the rotation mechanism, and between the substrate Wand the ring Wof the processing target W supported by the tablerotating by the rotation mechanism in accordance with a rotation number of the tableto supply the liquid between the substrate Wand the ring Wof the processing target W.

Substrate processing apparatus and substrate processing method

A suction stage may include a mounting section configured to mount a first substrate, and an evacuation section configured to evacuate air between the first substrate and the mounting section. The mounting section includes a ring-shaped first wall part, and a ring-shaped second wall part inside the first wall part. The evacuation section includes a first control valve between the evacuation section and a first region between the first and second wall parts, a second control valve between the evacuation section and a second region inside the second wall part, and a control section configured to control the valves. The control section is configured to control the valves so that suction and non-suction of the first substrate are alternately performed in at least one of the regions. Thus, suction of the first substrate may be deactivated in one of the regions, while the suction is active in the other region.

Suction stage, lamination device, and method for manufacturing laminated substrate

A liquid feeding device that feeds a treatment liquid to a treating device and also recovers the treatment liquid for re-feeding, include feeding tanks having an exhaust passage and an overflow line, and can be switched to one of a feeding mode in which the treatment liquid is fed and a standby mode in which the feeding tank is on standby while accommodating the treatment liquid; a feeding mechanism that feeds the treatment liquid to the treating device from the feeding tank in the feeding mode among the plurality of feeding tanks; a recovery mechanism that recovers and returns the treatment liquid excessive in the treatment device to the feeding tank in the feeding mode; and an on-off mechanism provided in each of the plurality of feeding tanks to block the exhaust passage and the overflow line is provided.

Liquid feeding device and substrate treating device

According to one embodiment, a bonding apparatus for processing a retained substrate includes a main body unit, a nozzle, a gas supply unit, and a substrate support unit. The nozzle opens on a face of the main body unit on a side that a first substrate is retained. The gas supply unit is configured to supply gas to the nozzle, to apply suction to the first substrate and to separate the substrate from the face of the main body unit. The substrate support unit is configured to support a peripheral edge portion of a second substrate provided in opposition to the first substrate with a predetermined gap.

Growing community of inventors

Yokohama, Japan

Emi Matsui