Texas Instruments Corporation

Emerson Mamaril Enipin

John Carlo Cruz Molina

Bernard Kaebin Andres Ancheta

Vikas I Gupta

Rajiv Carl Dunne

Michael Todd Wyant

Patricia Sabran Conde

A method of making a semiconductor device includes mounting at least two semiconductor dies to a die pad of a leadframe in spaced apart relation to each other, the leadframe having a plurality of preformed leads, electrically connecting each semiconductor die to at least one preformed lead of the leadframe, forming a molding structure including at least part of the semiconductor dies and the preformed leads of the leadframe, and forming a trench in the molding structure in a space between the at least two semiconductor dies, the trench separating the die pad into first and second die pad portions.

MCM package isolation through leadframe design and package saw process

A method of making a stacked semiconductor package having at least a leadframe, a first die mounted above and soldered to the lead frame and a first clip mounted above and soldered to the first die. The method includes positioning the leadframe, first die and first clip in a vertically stacked relationship and nonsolderingly locking the first clip in laterally nondisplaceble relationship with the leadframe. A stacked semiconductor package and an intermediate product produced in making a stacked semiconductor package are also disclosed.

Process of making a stacked semiconductor package having a clip

Growing community of inventors

Angeles, Philippines

Emerson Mamaril Enipin