Performance Motion Devices, Inc.

Emanuel Gustav Lewin

Peter Fransiscus Vandermeulen

Peng Li

Ahmad R Shouman

David Chanan Horovitch Shmelzer

Jonathan Robert Leehey

Arthur Robert Nigro, Jr

Steven M Johnson

Prabhakar Gowrisankaran

Andrew Colletta

James Richard Gort

Guy Richard Raiti

Thomas Keller

A package for securing a PCB to a heatsink includes mounts with over-torque protection features. The PCB is seated in an open end of the package. Each mount includes a threaded opening for securing the package to the heatsink such that the base layer of the PCB is thermally coupled to the heat sink. The over-torque protection features are connected between the threaded opening and a sidewall of the package. The over-torque protection features may be designed to structurally fail and/or deform in response to over-torqueing of the fasteners, thereby inhibiting flexure of the PCB.

Over-torque protection features for mounting an electronic device to a heat dissipation object

An enclosed digital power amplifier has features for accommodating thermal cycling. The digital power amplifier includes an amplifier board and a controller board, both of which are in a protective housing. The amplifier board includes electronic components mounted on a copper circuit layer that is disposed on a dielectric layer that is disposed on an aluminum substrate layer. The housing includes slotted mounting projections that extend from sidewalls to isolate fasteners from the aluminum substrate layer, and thereby accommodate expansion of the aluminum substrate layer while the digital power amplifier is secured to a surface by the fasteners. Bottom edges of the sidewalls contact a top outer edge of the amplifier board. The mounting projections contact side outer edges of the first circuit board. At least a portion of the aluminum substrate layer extends beyond the bottom edges of the sidewalls of the housing, forming an end wall, such that the housing does not inhibit thermally coupling the aluminum substrate layer to another surface such as a heat exchanger.

Dissipating heat from an electronic device in a protective housing

A motion control system provides optimized communications within and between an amplifier and a profile generation subsystem. In particular, the communications can provide data streams between components of the motion control that are derived from observed variables of the motion system. An amplifier subsystem drives a motor and output motor data indicating status of the motor. The profile generation subsystem issues motor control commands to the amplifier subsystem and generates motor summary data based on the motor data. The profile generation subsystem selectively output an error signal based on at least one of the motor data and motor summary data.

Motion system with sensor outputs and haptic controls

A motor control module provides control of a plurality of different motor types, such as a 1-phase DC Brush motor, a 3-phase brushless DC motor, and a 2-phase step motor. The module includes a digital amplifier that is configurable to drive the plurality of different motor types. A motor control unit, coupled to the digital amplifier, controls a motor type driven by the digital amplifier via a command signal to the digital amplifier. The motor control unit also monitors status information about the motor control module, including status information about the digital amplifier. A motor coil interface is coupled to the digital amplifier and configured to connect with the plurality of different motor types.

Multi-motor controller

In order to reduce the time and expense of designing and operating a motor control system with multiple motors of different types, a motor control system is provided with motor control modules that monitor and record status information and update settings in a uniform manner regardless of the motor type under control. Each motor control module includes an output power stage and a motor control unit connected to each other. The status information includes status information about the output power stage or a current control loop connected to the output power stage. The settings include conditions monitored by each motor control module and corresponding actions taken by each motor control module based on the conditions. A host processor connected to the multiple motor control modules may request the common status information and send messages to update common settings of the motor control modules.

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Lincoln, MA, United States of America

Emanuel Gustav Lewin