Infineon Technologies Ag

St Assembly Test Services Inc.

Elstan Anthony Fernandez

Alvin Seah

Chow Seng Guan

A semiconductor device includes a substrate, a die assembly attachable to the substrate and a flexible strip extending over the substrate and the die assembly. The flexible strip has one or more routing circuits carried thereon. The die assembly and the substrate are arranged to be electrically connected through the one or more routing circuits carried on the flexible strip.

Method for connecting a die assembly to a substrate in an integrated circuit

Method for connecting a die assembly to a substrate in an integrated circuit and a semiconductor device comprising a die assembly

An integrated circuit package includes a flexible laminar substrate. The substratehas a flexible layerof heat conductive material on one of its faces. The layerextends across an aperturein the flexible substrate. A first integrated circuitis mounted on the layerwithin the aperture, and wire bonded to the substrate. A flip chipis mounted on the first integrated circuit. The two integrated circuitsare embedded in a resin body

Integrated circuit package employing a flexible substrate

An integrated circuit package is proposed in which a laminar substrateis provided with an aperture. A heat-spreader memberis mounted to cover this aperture, and contains a cavityopening towards the aperturein the substrate. A stack of integrated circuit circuits, are located with one integrated circuitof the stack inserted into the cavity, and one integrated circuitof the stack electrically connected to the substrate

Integrated circuit package employing a heat-spreader member

A new method is provided for the connection of heat conducting copper pads, eliminating the need for these heat conducting pads to be connected directly to the ground ring, further eliminating the need for the ground ring to be the external ring that is provided on a surface of the package.

Growing community of inventors

Singapore, Singapore

Elstan Anthony Fernandez