Rodel Inc.

Rohm and Haas Electronic Materials Cmp Holdings, Inc.

Rodel Holdings, Inc.

Elmer William Jensen

William D Budinger

Heinz F Reinhardt

Harry George McClain

John V H Roberts

John V Roberts

Gregory Brancaleoni

The present invention provides a method of polishing a semiconductor device comprising, polishing the semiconductor device with a polishing pad, the polishing pad comprising, a polymeric matrix and a dissolvable substance. The dissolvable substance is located at a work surface of the polishing pad and in a subsurface proximate the work surface. The method further comprises dissolving the dissolvable substance at the work surface while polishing the semiconductor device and wearing away the polishing pad while polishing the semiconductor device such that the subsurface becomes a new work surface that polishes the semiconductor device.

Method of polishing a semiconductor device

A polishing pad used in a method for polishing a semiconductor device is made by combining a polymeric matrix and a dissolvable substance that dissolves upon contact with a polishing slurry.

Polishing pad for a semiconductor device having a dissolvable substance

An article or polishing pad for altering a surface of a workpiece includes a polymeric matrix having a work surface and a subsurface proximate to the work surface. When the article is in contact with a working environment, the work surface is made relatively softer than the subsurface as a result of exposure to the working environment. As the work surface wears during use, the subsurface immediately adjacent to the work surface becomes exposed to the working environment and becomes the relatively softer work surface. As a result, the relatively softer work surface is continuously regenerated. In an alternative embodiment, an article for altering a surface of a workpiece includes a work surface having a texture, and the texture includes artifacts arranged in a fractal pattern.

Polymeric polishing pad having continuously regenerated work surface

The present invention relates to an article of manufacture or polishing pad for altering a surface of a workpiece, such as polishing or planarizing a semiconductor device. The article includes a polymeric matrix impregnated with a plurality of polymeric microelements, each polymeric microelement having a void space therein. The article has a work surface and a subsurface proximate to the work surface. When the article is in contact with a working environment, polymeric microelements at the work surface of the article are less rigid than polymeric elements embedded in the subsurface. As the work surface of the article is abraded during use, the work surface of the pad may be continuously regenerated. In alternative preferred embodiments, the work surface may further include a minitexture and/or a macrotexture. Preferably, the minitexture is formed by fractal patterning at least a portion of the work surface. The present invention also includes methods for decreasing the effective rigidity of polymeric microelements at the work surface of the article, regenerating the work surface of the article and planarizing a surface of a semiconductor device utilizing the article.

Method for planarizing a semiconductor device surface with polymeric pad

Polymeric polishing pad containing hollow polymeric microelements

The present invention relates to an apparatus for polishing semiconductor wafers and, in particular, one in which the polishing pads are linear, that is, the polishing pads have a long linear dimension relative to their width and have a uniform cross-section along this linear dimension. In addition, the wafer holder travels in a straight line parallel to the long linear dimension of the polishing pads.

Polishing apparatus and method using a rotary work holder travelling

An abrasive composition for use in polishing or planarizing the surface of a work piece is provided comprising about 30 to 50 percent of cerium oxide; about 8 to about 20 percent of fumed silica and about 15 to about 45 percent of precipitated silica. Methods using the composition to polish or planarize the surfaces of work pieces, as well as products produced by such methods, are also provided.

Compositions and methods for polishing and planarizing surfaces

An improved polishing pad material is produced by modifying conventional poromeric materials in which a porous thermoplastic resin matrix, typically polyurethane, is reinforced with a fibrous network such as a felted mat of polyester fibers. The polishing material is modified by coalescing the resin among the fibers, preferably by heat treatment, to increase the porosity and hardness of the material as well increasing the surface activity of the resin. The polishing material may also incorporate polishing aids such as particulate abrasives and may also be used as a lapping or grinding material.

Growing community of inventors

New Castle, DE, United States of America

Elmer William Jensen