Analog Devices,inc.

Elmer S Lacsamana

Manolo G Mena

John R Martin

Maurice S Karpman

Lawrence E Felton

William A Webster

Michael P Duffy

A method of producing a MEMS device removes the bottom side of a device wafer after its movable structure is formed. To that end, the method provides the device wafer, which has an initial bottom side. Next, the method forms the movable structure on the device wafer, and then removes substantially the entire initial bottom side of the device wafer. Removal of the entire initial bottom side effectively forms a final bottom side.

Growing community of inventors

Pampanga, Philippines

Elmer S Lacsamana