Apple Inc.

Other

Elmar Gehlen

James E Pedder

Andreas Bibl

Ion Bita

Jonathan S Steckel

Sajjad Ali Khan

Kelly C McGroddy

Jean-Jacques P Drolet

James Michael Perkins

Francois R Jacob

Roland Van Gelder

Jonathan P Mar

Xin Zhao

Hopil Bae

Paolo Sacchetto

Abbas Jamshidi Roudbari

Wei Lin

Warren S Rieutort-Louis

Sunggu Kang

Marc Joseph DeVincentis

Mahdi Farrokh Baroughi

Steven E Molesa

Tiffany T Moy

Sandeep Chalasani

Zuoqian Wang

Ian D Tracy

Jui-Chih Liao

Xia Li

Paul Stephen Drzaic

Stephen Robert McClure

Derek William Wright

Nathan K Gupta

Tore Nauta

Zhen Zhang

Young Cheol Yang

Soyoung Kim

Izhar Zahoor Ahmed

Tingjun Xu

Kian Kerman

Michael Vosgueritchian

Xiaonan Wen

Jin Yan

Jaein Choi

Paul S Drzaic

Brent J Bollman

Di Liu

Wei-Liang Hsu

Hjalmar Edzer Ayco Huitema

Anshi Liang

Sudirukkuge T Jinasundera

Yong Sun

Ran He

Prithu Sharma

Han-Chieh Chang

Arnoldus Alvin Barlian

Dongwoo Shin

Izhar Z Ahmed

Gilbert Huppert

Ruize Xu

Display structures and methods of manufacture of display structure including a display panel with a curved three-dimensional film contour are described. In an embodiment, a display panel includes display area with a main body area and a plurality of petals extending from the main body area. The petals are folded into a curved three-dimensional (3D) film contour, and are separated by corresponding trenches between petals. The trenches may be filled with various seam hiding materials to visually obscure the trenches.

Display structure for electronic devices

An electronic device display may have pixels formed from crystalline semiconductor light-emitting diode dies, organic light-emitting diodes, or other pixel structures. The pixels may be formed on a display panel substrate. A display panel may extend continuously across the display or multiple display panels may be tiled in two dimensions to cover a larger display area. Interconnect substrates may have outwardly facing contacts that are electrically shorted to corresponding inwardly facing contacts such as inwardly facing metal pillars associated with the display panels. The interconnect substrates may be supported by glass layers. Integrated circuits may be embedded in the display panels and/or in the interconnect substrates. A display may have an active area with pixels that includes non-spline pixels in a non-spline display portion located above a straight edge of the display and spline pixel in a spline display portion located above a curved edge of the display.

Electronic devices with borderless displays

Display panels and methods of manufacture are described for down converting a peak emission wavelength of a pump LED within a subpixel with a quantum dot layer. In some embodiments, pump LEDs with a peak emission wavelength below 500 nm, such as between 340 nm and 420 nm are used. QD layers in accordance with embodiments can be integrated into a variety of display panel structures including a wavelength conversion cover arrangement, QD patch arrangement, or QD layers patterned on the display substrate.

Light emitting structure to aid LED light extraction

Quantum dot integration schemes

An electronic device may have layers of glass for forming components such as a display. A display cover glass layer may overlap an array of pixels. A touch sensor may be formed under the display cover glass layer. Conductive structures such as transparent conductive electrodes or other conductive layers of material may be formed on the outer surface of the display cover glass layer. The electrodes on the outer surface of the display cover glass layer may be coupled to metal contacts and other circuitry on the inner surface of the display cover glass layer using conductive vias. Vias may be provided with barrier layers, opaque coatings, tapers, and other structures and may be formed using techniques that enhance compatibility with chemical strengthening processes.

Electronic device display vias

Growing community of inventors

Cupertino, CA, United States of America

Elmar Gehlen