Sarnoff Corporation

Lamina Ceramics, Inc.

Other

Sharp Corporation

David Sarnoff Research Center, Inc.

Alpha Assembly Solutions Inc.

Sharp K.k.

Sharp Kabushiki Kaisha Corporation

Ferro Corporation

Lighting Science Group Corporation

Lamina Ceramics, in

Ellen Schwartz Tormey

Ashok Narayan Prabhu

Barry Jay Thaler

Attiganal Narayanaswamy Sreeram

Mark Stuart Hammond

Ananda H Kumar

Michael James Liberatore

Leszek Hozer

Bernard Dov Geller

Bawa Singh

Joseph B Mazzochette

John Charles Connolly

Ramon Ubaldo Martinelli

Ashok Naryan Prabhu

Gerard Frederickson

Hung-tse Daniel Chen

Steven Dane Prokopiak

Ponnuswamy Palanisamy

Srinivasan Sridharan

George E Sakoske

Oscar Khaselev

Michael T Marczi

Edward Ernest Bailey

John J Maloney

Ranjit Pandher

Yie-Shein Her

Aly Eid Fathy

Stewart Mark Perlow

Sanyogita Arora

Jackie D Davis

Girard Sidone

Mohammed H Megherhi

Stanley Wang

Kalipada Palit

Orville Washington Brown

Cody J Gleason

Paul Koep

David L Widlewski

Thomas Joseph Coffey

Joo-Dong Yu

Yun-Hwi Park

Sung-Dae Park

Je-Do Mun

In-Tae Kim

Israel Haim Kalish

Ponnusamy Palinasamy

Valerie Ann Pendrick

Peter Marley

Attiganal Narayanaswamysreeram

Ranjit S Pandher

A thermal managing electrical connection tape includes a carrier film and a composition including solder powder, with the composition being applied to the carrier film. The composition includes a soldering flux having the solder powder disposed therein. The composition contains between about 50 wt % and about 70 wt % soldering flux. The composition further contains between about 30 wt % and about 50 wt % solder powder. A method of fabricating a thermal managing electrical connection tape includes providing a composition including at least one of a soldering flux and epoxy and/or acrylic, adding a solder powder to the composition, casting the composition on a carrier film, drying the carrier film in a drying furnace to form a dried tape, and cutting the dried tape to a desired width to form a thermal managing electrical connection tape.

Electrical connection tape

A low K value, high Q value, low firing dielectric material and method of forming a fired dielectric material. The dielectric material can be fired below 950&#xb0; C. or below 1100&#xb0; C., has a K value of less than about 8 at 10-30 GHz and a Q value of greater than 500 or greater than 1000 at 10-30 GHz. The dielectric material includes, before firing a solids portion including 10-95 wt % or 10-99 wt % silica powder and 5-90 wt % or 1-90 wt % glass component. The glass component includes 50-90 mole % SiO, 5-35 mole % or 0.1-35 mole % BO, 0.1-10 mole % or 0.1-25 mole % AlO, 0.1-10 mole % KO, 0.1-10 mole % NaO, 0.1-20 mole % LiO, 0.1-30 mole % F. The total amount of LiO+NaO+KO is 0.1-30 mole % of the glass component. The silica powder can be amorphous or crystalline.

Low K dielectric compositions for high frequency applications

A jettable etchant composition includes 1 to 90 wt % active ingredient, and a remainder containing any combination of the following: 10 to 90 wt % solvent, 0 to 10 wt % reducing agents, &#x3c;1 to 20 wt % pickling agent, 0 to 5 wt % surfactant, and 0 to 5 wt % antifoam agent. The composition can also include a soluble compound containing at least one element which when dissolved has a higher standard electrode potential than a metal to be etched or a soluble compound containing a group IA element, and a soluble platinum group metal. An ink composition can include a group VA compound or a group IIIA compound in a solvent system formulated to be jettable on a surface at a drop volume of about 5 to about 10 picoliters and to achieve a final sheet resistance of less than about 20 &#x3a9;/&#x3b1; of the surface upon activation.

Jettable inks for solar cell and semiconductor fabrication

A method of assembling components, such as electronic components, onto a substrate, such as an electronic substrate, includes applying solder paste to an electronic substrate to form a solder paste deposit, placing a low temperature preform in the solder paste deposit, processing the electronic substrate at a reflow temperature of the solder paste to create a low temperature solder joint, and processing the low temperature solder joint at a reflow temperature that is lower than the reflow temperature of the solder paste. Other methods of assembling components and solder joint compositions are further disclosed.

Solder preforms and solder alloy assembly methods

The present invention relates to an LED lighting system producing light having improved Color Rendering Index (CRI). The system includes a plurality of LEDs wherein the LEDs have at least a first and second characteristic wavelength, and a mixed phosphor layer overlying at least one of a portion of the plurality of LEDs, the phosphor layer absorbing at least a portion of the LED-emitted light and producing phosphor-emitted light, wherein the phosphors includes a third characteristic wavelength and a fourth characteristic wavelength, wherein the third characteristic wavelength and fourth characteristic wavelength are not the same.

High color rendering index white LED light system using multi-wavelength pump sources and mixed phosphors

A multilayer ceramic circuit board comprises a core of high conductivity material such as metal and an overlying layer of electrically insulating ceramic having an outer surface. In accordance with the invention, a circuit board for receiving a high power component is provided with a thermal spreading layer on or near the outer surface and one or more thermal vias through the ceramic to thermally couple the spreading layer to the core. The vias and the spreading layer comprise electrically insulating thermally conductive materials. The resulting structure provides rapid heat dissipation for a high power component formed or mounted on or near the spreading layer.

Method and structures for enhanced temperature control of high power components on multilayer LTCC and LTCC-M boards

A package for an electronic component includes a metal support substrate having a pattern of openings therethrough and a body of an insulating material, such as glass or ceramic, on and bonded to the surface of the support substrate. The body is formed from a plurality of layers of an insulating material, and conductive vias extending through the plurality of layers to the support substrate; said insulating body having an opening therein, an electronic component directly mounted in said opening to the patterned base plate. The base plate can be cut into one or more modules and directly soldered to a motherboard having additional devices mounted thereon.

Method of making ceramic multilayer circuit boards mounted in a patterned metal support substrate

Integrated packages incorporating multilayer ceramic circuit boards mounted on a metal support substrate can be used for temperature control by the metal support substrate. Various electronic components, as well as additional temperature control devices, can be connected to the circuit boards and to the metal support substrate to control or regulate the temperature of operation of the components. The integrated package can be hermetically sealed with a lid.

Low temperature co-fired ceramic-metal packaging technology

Materials for making a plasma display having a transparent front panel spaced from a back panel which is a metal core having layers of a dielectric material extending over and bonded to the core. The materials of which the back panel is made are chosen to form a back panel having a thermal coefficient of expansion compatible with that of the front panel. The dielectric material is made from a green ceramic tape which is bonded to the core and cofired with the core to form the back panel. The materials for the dielectric can be chosen such that the composite TCE of the cofired assembly matches the TCE of the front panel.

Materials to fabricate a high resolution plasma display back panel

Ceramic multilayer circuit boards mounted on a patterned metal support substrate

Integrated heat sinking packages using low temperature co-fired ceramic metal circuit board technology

Resistors can be screen printed onto a green tape stack from a resistor ink comprising ruthenium oxide and a sufficient amount of a low melting temperature glass so that the resultant mixture fires at a temperature of 850-900&deg; C. A conductive layer, as of silver, terminates the screen printed resistor layer and one or two green tapes are applied over the resistor layer to embed the resistors during firing. A final conductive layer is applied after firing.

Multilayer ceramic circuit boards with embedded resistors

High dielectric constant capacitors are made from a dielectric ink of lead-magnesium-niobate and lead oxide powders. Dielectric inks are made by mixing the dielectric powders with a suitable organic vehicle which can be used to coat one or more glass-based green tapes. Buried capacitors are made by coating an overlying and an underlying green tape with a conductor such as silver. Capacitors can also be made by adjusting the organic vehicle and forming a green tape from the dielectric powders. These dielectric green tapes each can be coated with a conductive layer and stacked, the conductive layers connected in parallel. The resultant multilayer capacitors have a very high dielectric constant, while eliminating the need for very large area capacitors, as compared to single layer capacitors.

High dielectric constant embedded capacitors

Embedded passive components such as capacitors are formed in multilayer ceramic circuit boards by screen printing a component precursor compound ink sandwiched between conductor ink layers onto a green tape stack and covering the component ink layer with one or two green tape layers, aligning and laminating the green tapes and firing. Capacitor inks are made from dielectrics chosen from barium titanate, titanium oxide and lead-magnesium-niobate. The green tapes are made of a mixture of a crystallizing glass, a non-crystallizing glass and an oxide filler which does not shrink in the x and y dimensions during firing mounted on a metal support. Thus the embedded components can be made to close tolerances.

Multilayer ceramic circuit boards including embedded components

High magnesium-content magnesium aluminosilicate glasses are used to form green tape compositions that are fired stepwise, i.e., first to about 500.degree. C. to remove organic materials, then to a temperature 10-30.degree. C. above the glass transition temperature for a time sufficient to nucleate the glass, and finally to a higher temperature near but below the softening temperature to complete crystallization of the glass. The resultant glass-ceramic may include substantial amounts of the forsterite crystalline phase. Multilayer ceramic printed circuit boards are made that are useful for high frequency, microwave applications. The fired high magnesium oxide content glasses have low dielectric constant and low dissipation loss factors, and they have a thermal coefficient of expansion that is compatible with metal or ceramic support substrates that impart mechanical strength to the printed circuit boards and that are thermally conductive. The boards are compatible with gallium arsenide devices.

Low dielectric loss glasses

Growing community of inventors

Princeton Junction, NJ, United States of America

Ellen Schwartz Tormey