Stats Chippac Pte. Ltd.

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Zigmund Ramirez Camacho

Henry Descalzo Bathan

Emmanuel Espiritu

A method of manufacture of an integrated circuit packaging system includes: forming a package paddle; forming a lead adjacent to the package paddle; depositing a lead conductive cap on the lead, the lead conductive cap includes a nickel layer having a thickness between 2.55 &#x3bc;m to 8.00 &#x3bc;m deposited on the lead, a palladium layer deposited on the nickel layer, and a gold layer deposited on the palladium layer; mounting an integrated circuit over the package paddle; attaching an electrical connector between the lead conductive cap and the integrated circuit; and forming an encapsulation over the integrated circuit, a portion of the lead, and a portion of the package paddle.

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Singapore, Singapore

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