Lv Sensors, Inc.

Pacific Biosciences of California, Inc.

Amphenol Thermometrics, Inc.

Elizabeth Logan

Curtis A Ray

Takashi Whitney Orimoto

Ravi Saxena

Janusz Bryzek

Jeffrey S Braden

Sisira Kankanam Gamage

Brian Lee Bircumshaw

Ronald Almy Hollis

Terry Lee Marvin Cookson

Disclosed are packaging methods for the fabrication of analytical device packages and fabricated analytical device packages. The methods include providing a sensor wafer and mounting individual plates or a plate wafer on the sensor wafer. The sensor wafer includes sensor chips with aperture regions and is treated with selective depositions, either prior to or during the fabrication of the analytical device packages, to produce different surface characteristics at different portions of the aperture regions. Before dicing the sensor wafer, openings of the individual plates or the plate wafer are covered by a protective layer to protect surface characteristics at different portions of the aperture regions. A fabricated analytical device package includes a sensor chip with different surface characteristics, a plate, a packaging substrate and an optional cover.

Packaging methods for fabrication of analytical device packages and analytical device packages made thereof

A method of attaching a die to a carrier using a temporary attach material is disclosed. The method comprises attaching the temporary attach material between a surface of the die and a surface of the carrier. The temporary attach material attaches the die to the carrier. The method comprises bonding at least one connector to the die and the carrier. The connector includes a first end bonded to the carrier and a second end bonded to the die. The method further comprises encapsulating at least a portion of the die and at least a portion of the at least one connector by an encapsulation material.

Component assembly using a temporary attach material

Partitioning electronic sensor packages is provided. The electronic sensor package includes an electronic component, a sensor device, and electrical connections between the electronic component and the sensor device. A dam is written in the electronic sensor package to partition the package into two or more sections, where the sensor device is situated at least partially in one section and the electronic component is situated at least partially in another section. The partitioning of the dam allows the two sections to be filled with different fill materials. For example, the section with the sensor device can be filled with a soft gel-like material to provide some moisture protection to the sensor device without causing detrimental stresses to the sensor device, while the section with the electronic component can be filled with a highly moisture protective epoxy.

Partitioning of electronic packages

The present invention provides a tire pressure sensor system that has multiple functions and is integrated into a small package. The system includes one or more Micro Electro Mechanical System (MEMS)-based sensors, including a MEMS-based pressure sensor; a MEMS-oscillator-based wireless signal transmitter; and a microcontroller, where the microcontroller processes the data generated by at least one of the MEMS-based sensors, controls at least one of the MEMS-based sensors, and controls the encoding and timing of transmission of data from the wireless signal transmitter. Preferably, the MEMS-based sensors, MEMS-oscillator-based wireless signal transmitter, and microcontroller are integrated onto one or more chips in one or more packages. The system also preferably includes a MEMS-based motion sensor, a low frequency (LF) receiver, an IC-based voltage sensor, a voltage regulator, a temperature sensor and a polarization voltage generator. Thus, the disclosed tire pressure sensor system is high in functionality, yet small in size.

Integrated tire pressure sensor system

Improved sensor packaging is provided with a hybrid integration approach. In one example, an application specific integrated circuit (ASIC) for sensor signal conditioning is packaged. The ASIC package has an aperture in it that exposes a chip to chip bonding interface of the ASIC chip. The rest of the ASIC chip is surrounded by the package, including the connections between the external package leads and the ASIC chip. A sensor chip, also having a chip to chip bonding interface, is disposed in the package aperture and bonded to the ASIC chip such that the two chip to chip bonding interfaces are connected. Flip chip bonding of the sensor chip to the ASIC chip is a preferred approach for chip to chip bonding. The vertical gap between the two chips can be filled in by an underfill process. The lateral gap between the sensor chip and the package can also be filled.

Growing community of inventors

Danville, CA, United States of America

Elizabeth Logan