Advanced Technology Materials, Inc.

Exxonmobil Chemical Patents Inc.

Post Foods, LLC

Elizabeth L Walker

Jeffrey A Barnes

Kevin Paul Yanders

Ewa Oldak

Shahri Naghshineh

Hong Cheng

Patrick Brant

Donna Jean Crowther

Andy Haishung Tsou

Edward John Blok

Yong Yang

Shuji Luo

Man Kit Ng

Jingwen Zhang

Darryl W Peters

Suzzy C H Ho

Shahriar Naghshineh

Jeff Barnes

George M Squire

William P Citarella

Darryl Peters

Jeffrey Barnes

A polyolefin-polybutadiene block-copolymer and a tire tread composition comprising the polyolefin-polybutadiene block-copolymer, the composition comprising, by weight of the composition, within the range from 15 to 60 wt % of a styrenic copolymer, processing oil, filler, a curative agent, and from 4 to 20 wt % of a polyolefin-polybutadiene block-copolymer, wherein the polyolefin-polybutadiene block-copolymer is a block copolymer having the general formula PO-XL-fPB; where 'PO' is a polyolefin block having a weight average molecular weight within the range from 1000 to 150,000 g/mole, the 'fPB' is a functionalized polar polybutadiene block having a weight average molecular weight within the range from 500 to 30,000 g/mole, and &#x201c;XL&#x201d; is a cross-linking moiety that covalently links the PO and fPB blocks; and wherein the maximum Energy Loss (Tangent Delta) of the immiscible polyolefin domain is a temperature within the range from &#x2212;30&#xb0; C. to 10&#xb0; C.

Compatibilized tire tread compositions

This invention relates to a polyolefin comprising one or more aromatic moieties according to the following formulae: wherein the PO is the residual portion of a vinyl terminated macromonomer (VTM) having had a terminal unsaturated carbon of an allylic chain and a vinyl carbon adjacent to the terminal unsaturated carbon;

Friedel crafts alkylation of aromatics using vinyl terminated macromonomers

Compositions useful in microelectronic device manufacturing for surface preparation and/or cleaning of wafer substrates such as microelectronic device precursor structures. The compositions can be employed for processing of wafers that have, or are intended to be further processed to include, copper metallization, e.g., in operations such as surface preparation, pre-plating cleaning, post-etching cleaning, and post-chemical mechanical polishing cleaning of microelectronic device wafers. The compositions contain (i) alkanolamine, (ii) quaternary ammonium hydroxide and (iii) a complexing agent, and are storage-stable, as well as non-darkening and degradation-resistant in exposure to oxygen.

Compositions for processing of semiconductor substrates

Compositions useful in semiconductor manufacturing for surface preparation and/or cleaning of wafer substrates such as semiconductor device precursor structures. The compositions can be employed for processing of wafers that have, or are intended to be further processed to include, copper metallization, e.g., in operations such as surface preparation, pre-plating cleaning, post-etching cleaning, and post-chemical mechanical polishing cleaning of semiconductor wafers. The compositions contain (i) alkanolamine, (ii) quaternary ammonium hydroxide and (iii) a complexing agent, and are storage-stable, as well as non-darkening and degradation-resistant in exposure to oxygen.

A cleaning solution is provided for cleaning metal-containing microelectronic substrates, particularly for post etch, via formation and post CMP cleaning. The cleaning solution consists of a quaternary ammonium hydroxide, an organic amine, and water. A preferred cleaning solution consists of tetramethylammonium hydroxide, monoethanolamine, and water. The pH of cleaning solution is greater than 10.

Aqueous cleaner with low metal etch rate comprising alkanolamine and tetraalkylammonium hydroxide

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Stockertown, PA, United States of America

Elizabeth L Walker