E.i. Dupont De Nemours and Company

E. I. Du Pont Nemours and Co.

Wemtec Inc.

Elizabeth D Hughes

Deepukumar M Nair

James M Parisi

Michael Arnett Smith

Joao Carlos Malerbi

William E McKinzie, Iii

Kumaran M Nair

Scott E Gordon

Ken E Souders

Bradley Thrasher

Substrates and methods to fabricate and use millimeter wave Sievenpiper EBG structures such that the conductive portions are internal to an LTCC package.

Method of fabricating electromagnetic bandgap (EBG) structures for microwave/millimeterwave applications using laser processing of unfired low temperature co-fired ceramic (LTCC) tape

Disclosed are methods and devices of microwave/millimeter wave package application.

Low temperature co-fired ceramic (LTCC) system in a package (SiP) configurations for microwave/millimeter wave packaging applications

Disclosed herein is a multilayer low temperature co-fired ceramic (LTCC) structure comprising a multilayer low temperature co-fired ceramic comprising glass-ceramic dielectric layers with screen printed thick film inner conductors on portions of the layers and with thin film outer conductors deposited on the upper and lower outer surfaces of the LTCC. At least a portion of the thin film outer conductors is patterned in the form of lines and the spacings between the lines are less then 50 &#x3bc;m. Also disclosed is a process for making the LTCC structure.

Low temperature co-fired ceramic structure for high frequency applications and process for making same

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Raleigh, NC, United States of America

Elizabeth D Hughes