Relief Technologies, Inc.

Therapy Holdings, Inc.

Elizabeth Ann Miracle

Jonathan Moulton Thomas

Brian James Krieger

Grace Hina Lee

Richard Thomas Caligaris

A heating device includes a heating unit and device electronics. The heating unit is configured to deliver heat to a user's body. The heating unit includes a substrate and a heating element supported by the substrate. The device electronics are coupled to the heating element and are configured to store a first heating profile that includes data indicating how power should be delivered to the heating element over a first period of time. The device electronics are configured to deliver power to the heating element according to the first heating profile. The device electronics are configured to wirelessly receive a second heating profile from an external computing device. The second heating profile includes data indicating how power should be delivered to the heating element over a second period of time. The device electronics are configured to deliver power to the heating element according to the second heating profile.

Heating devices

A pressure-sensing device includes a device frame, a flexible membrane, a pressure sensor, and device electronics. The device frame includes a base surface that rests on a supporting structure and a frame attachment region located opposite to the base surface such that the frame attachment region is raised from the supporting structure when the base surface is resting on the supporting structure. The device frame also includes a seating surface. The flexible membrane is attached to the frame attachment region such that the device frame and the flexible membrane enclose a pressure chamber. The seating surface extends outward around the flexible membrane and the flexible membrane protrudes above the seating surface. The pressure sensor is configured to generate a pressure signal. The device electronics are configured to determine the pressure in the pressure chamber based on the pressure signal.

Pressure-sensing devices

A cooling device includes a package substrate, a plurality of cooling units, and device electronics. The plurality of cooling units are configured to cool a user's body. Each cooling unit includes a plurality of semiconductor cooling elements sandwiched between a first cooling unit substrate and a second cooling unit substrate. Each of the cooling units is connected to the package substrate. The device electronics are coupled to the cooling units. The device electronics are configured to store a first cooling device profile that includes data indicating an amount of power to deliver to each of the cooling units over a period of time. The device electronics are configured to deliver power to the cooling units according to the first cooling device profile, wirelessly receive a second cooling device profile from an external computing device, and deliver power to the cooling units according to the second cooling device profile.

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San Francisco, CA, United States of America

Elizabeth Ann Miracle