Orbotech Limited

Orbtech Ltd.

Eliezer Lipman

Zvi Kotler

Abraham Gross

Dan Alon

Yehiam Prior

Michael Zenou

Golan Hanina

Boris Greenberg

A system for delivering energy to a substrate includes a laser energy source providing a plurality of laser beams, wherein each of the beams is steered to an independently selectable location on a target, and is independently focused onto the target.

Multiple beam micro-machining system and method

A method for micromachining a material, including configuring an optical system to provide illumination of an illumination wavelength to a site via a given element of the optical system, the illumination generating returning radiation from the site. The method further includes configuring the optical system to receive the returning radiation via the given element, and to form an image of the site therefrom, calculating an actual position of a location at the site from the image and outputting a signal indicative of the actual position of the location, generating a beam of micromachining radiation having a micromachining wavelength different from the illumination wavelength, positioning the beam to form an aligned beam with respect to the location in response to the signal, and conveying the aligned beam to the location via at least the given element of the optical system so as to perform a micromachining operation at the location.

Alignment of printed circuit board targets

A system for delivering energy to a substrate including a dynamically directable source of radiant energy providing a plurality of beams of radiation, each propagating in a dynamically selectable direction. Independently positionable beam steering elements in a plurality of beam steering elements are operative to receive the beams and direct them to selectable locations on the substrate.

Micro-machining system employing a two stage beam steering mechanism

A dynamic beam splitter including a beam deflector having a plurality of operative regions, the beam deflector being operative to receive a laser beam at a first one of the plurality of operative regions, the laser beam passing through the beam deflector, and to selectably direct the laser beam in response to a control input signal to pass through the beam deflector a second time. Methods for splitting a beam and for manufacturing an electrical circuit employing the dynamic beam splitter are also enclosed.

Dynamic beam splitter outputting a selectable number of beams

Multiple beam micromachining system for removing at least two different layers of a substrate

A system for delivering energy to a substrate includes a laser energy source providing at least two laser beams, wherein each of the beams is steered to an independently selectable location on a target, and is independently focused onto the target.

Micro-machining employing multiple independently focused and independently steered beams

A system for unveiling embedded targets in printed circuit board substrates includes a micro-machining device, a sensor, and a controller. The micro-machining device removes portions of an opaque layer overlaying an alignment target in a general region in which the target should be located, and the sensor senses whether the alignment target is located at selected locations where portions of the opaque layer have been removed. In response to sensing the presence or absence of an alignment target at the selected locations, the controller directs the micro-machining device to remove additional portions of the opaque layer.

System and method for unveiling targets embedded in a multi-layered electrical circuit

Laser energy delivery system outputting beams having a selectable energy

A laser micromachining system improve the utilization of laser energy by using multiple spectral components or time-altered pulses.

Growing community of inventors

Rishon Lezion, Israel

Eliezer Lipman