International Business Machines Corporation

Elias Papanicolaou

Charles Chaolee Tai

Charles Robert Lamb

Kang-Wah Li

A method and apparatus for cooling electronic devices is suggested comprising of a thermally conductive, flexible, non-jointed cooling conduit able to house a coolant. The conduit is passed or pulled through apertures provided on two or more cold plates. The conduit and plates are then placed in thermal communication with the electronic device or assembly to be cooled. The flexibility of the conduit allows the conduit with plates to be rearranged as to conform to the contours of the device to be cooled.

Flexible cold plate having a one-piece coolant conduit and method

To achieve the above-mentioned objects, and other related ones a method and apparatus for cooling of an electronic assembly is suggested. The electronic assembly is placed in thermal contact with a monolithic, non-jointed flexible coolant conduit housing a coolant. A plurality of cold plates are then slipped over the conduit, through their indentation like opening along a peripheral edge of each plate. The conduit with plates is then bend so as to complement the contour of the assembly to be cooled.

Method for cooling electronic devices using a flexible coolant conduit

An apparatus for cooling an electronic assembly. The electronic assembly is placed in thermal contact with a single, continuous and monolithic coolant conduit capable of housing a coolant. A plurality of removable cold plates are coupled to the conduit, through their indentation like openings along a peripheral edge of each plate. The conduit with plates is then bent as to complement the contour of the assembly to be cooled in a three dimensional manner as required.

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Karlsruhe, Germany

Elias Papanicolaou