Hewlett-packard Development Company, L.P.

H3alth Technologies Inc.

Elias Gedamu

Denise Man

David Marshall

Karl Joseph Bois

Chantelle Anderson

Abraham Gedamu

Eric Richard Stubblefield

Lashitew Gedamu

Oguz Ertekin

Rani Hussein

A system and kit for capturing a 3D image of a body a user includes a plurality of pillar segments being configurable between an assembled configuration and a disassembled configuration. In the assembled configuration, the pillar segments are joined to form one or more upstanding sensing pillars. A plurality of sensors operable to capture image data are distributed along the one or more sensing pillars. The plurality of sensors have fields of view that are overlapping when supported on the sensing pillars. In the disassembled configuration, transportation of the pillar segments is facilitated. The system and kit may be suitable for use at a remote location. Additional functionalities may include a power storage unit, solar charging panels, climate control subsystem, and wireless communication submodule. In operation, the sensing pillars may be enclosed within an enclosure.

System, method and kit for 3D body imaging

The invention is directed to an electromagnetic air filtration system and process for removing charged pathogens, such as, the SARS-CoV-2 virus, from an air stream. The air filtration system and process provide a magnetic field within an airflow to remove charged pathogens from the airflow, thereby producing treated air.

Treatment of air streams with electromagnetic removal of viruses and charged pathogens

A system for manufacturing an artificial covering includes a 3D surface scanning module and a 3D printing module where an anatomical surface is imaged and the image is processed for manufacturing and embedding a sensor or device in the covering which can be used for diagnosis or sensing medical issues in the user.

System for manufacturing coverings for anatomical surfaces

A system and method for manufacturing custom fit artificial nails includes a 3D surface scanning module and a 3D printing module and use thereof. A central processing module is connected to the 3D surface scanning module and the 3D printing module and performs: operating the 3D surface scanning module to obtain an image of a user's hands/feet; processing the image to create an input 3D model of nails of the user; generating an output 3D model corresponding to artificial nails matching dimensions of the user's nails according to the 3D input model; operating the 3D printing module to manufacture artificial nails according to the output 3D model; and generating medical data by correlating the identified features of the user's nails with known medical conditions, in order to diagnose a medical condition of the user which is known to exhibit the identified features as a symptom. Alternatively, or additionally, medicinal ingredient may be included in the artificial nail to treat the medical condition of the user. Embedded devices, sensors or an RFID chip may be integrated into the artificial nail.

System and method for manufacturing custom nails

Systems, methods, and a computer program are disclosed. One embodiment comprises a compiler for developing verification tests of an integrated circuit. The compiler comprises an interface and a built-in self-test (BIST) emulator. The interface includes an input and an output. The interface receives and forwards operator-level instructions to the BIST emulator, which is coupled to the output. The BIST emulator simulates the operation of a BIST module within the integrated circuit.

Built-in self-test emulator

One embodiment of a method comprises retrieving test data corresponding to test results from a plurality of fuses, each one of the plurality of fuses residing on a different one of a plurality of semiconductor devices and each one of the plurality of fuses having a common location on the semiconductor devices, determining from the test data which of the plurality of fuses are defective fuses, and specifying on an output report the common location of the determined defective fuses when a number of the defective fuses are at least equal to a predefined portion of the plurality of fuses.

System and method for indication of fuse defects based upon analysis of fuse test data

A data bus for a printed circuit board is disclosed having a plurality of lines separated by a substrate. A method is also disclosed for creating a bus with a reduced reflection of signal energy at the interface between the bus and a receiving agent connected to the bus. The lines in the bus include data lines and at least two strobe lines that are positioned adjacent each other to take advantage of the known impedance inherent to their dominant coupling. The bus includes separate data-line terminations and strobe-line terminations connected to the data lines and strobe lines, respectively. The separate terminations have values matched to impedances calculated from the separate sets of lines to more effectively reduce the reflected energy by more accurately matching the impedances on the lines.

Data bus with separate matched line impedances and method of matching line impedances

One embodiment of a method for analysis of cache array test data comprises retrieving test results for a current period of time for a first plurality of storage elements and for a historical period of time for a second plurality of storage elements; determining a plurality of attributes for each of the first storage elements and the second storage elements based upon the test results, the attributes comprising one of a good condition, a defective condition, a repairable condition and a repaired condition; determining a plurality of attribute statistics corresponding to the attributes of the first storage elements and the second storage elements; and generating an output report indicating at least two of the attribute statistics of the first storage elements and the second storage elements.

System and method for analysis of cache array test data

Disclosed are a heat dissipation computer and method. In one embodiment, a heat dissipation apparatus comprises a heat sink that is adapted to receive a processor mounted thereto, the heat sink comprising an internal chamber that is adapted to receive a fluid flow that removes heat from the heat sink. In one embodiment, a method for dissipating heat generated by a processor comprises forcing fluid through an internal chamber formed within a heat sink to which the processor is mounted, forcing the fluid from the internal chamber of the heat sink through at least one hollow prong that extends from the heat sink and that is in fluid communication with the internal chamber of the heat sink, and forcing fluid over exterior surfaces of the at least one hollow prong.

Heat dissipation apparatus and method

Systems and methods are described for sharing signals across a common metal trace on a single metal layer of an integrated circuit. The signals are time division multiplexed across the common metal trace such that a single metal layer of an integrated circuit is used to multiplex signals to and from a poly-silicon layer, reducing utilization of upper metal layers of the integrated circuit.

Multiplexing system and method for crossing signals on a single metal layer of an integrated circuit

An embodiment of the invention provides a circuit and method for reducing power in dynamic circuits. A large single pre-charge FET is used to pre-charge the pre-charge nodes of all dynamic logic blocks contained in a plurality of dynamic logic blocks. The large single pre-charge FET replaces all smaller individual FETs that normally would be used. Because smaller FETs typically have more subthreshhold leakage than larger FETs, the overall subthreshhold leakage is reduced. The large pre-charge FET only replaces smaller pre-charge FETs that have the same pre-charge signal going to their gates.

Growing community of inventors

Calgary, Canada

Elias Gedamu