Kateeva, Inc.

Yield Engineering Systems, Inc.

Eli Vronsky

Alexander Sou-Kang Ko

Christopher R Hauf

Christopher F Lane

M Ziaul Karim

Ronald R Stevens

Lei Jing

Gabriel Ormonde

Jed Hsu

Taylor Nguyen

Ken Sautter

In a printing method, at least one image of a substrate supported in a printing system is acquired. An actual position of a first alignment feature on the substrate in a frame of reference of the printing system is determined based on the at least one image. Expected positions of second alignment features on the substrate are determined based on the actual position of the first alignment feature. Actual positions of the second alignment features in the frame of reference of the printing system are determined based on the at least one image and the expected positions of the second alignment features. Target positions of print regions on the substrate are determined based on the actual positions of the second alignment features. Ejection of print material onto the substrate in the print regions is controlled based on the target positions of the print regions.

Ejection control using substrate alignment features and print region alignment features

A solder reflow oven includes a processing chamber that defines an enclosure. The enclosure includes a spindle configured to support a substrate and rotate the substrate about a central axis of the processing chamber. The spindle is also configured to move vertically along the central axis and position the substrate at different locations within the enclosure. The oven further includes a chemical delivery tube configured to direct a chemical vapor into the enclosure, a lamp assembly configured to heat a top surface of the substrate, and a lift assembly configured to move the spindle along the central axis.

Processing oven

Growing community of inventors

Los Altos, CA, United States of America

Eli Vronsky