Technische Unversität Berlin

Ihp Gmbh-Innovations for High Performance Microelectronics/leibniz-Instit. Für Innovativeihp Gmbh-Innovations for High Performance Microelectronics/leibniz-Instit. Für Innovative

Elham Amini

Christian Boit

Marco Lisker

Jean-Pierre Seifert

Norbert Herfurth

A semiconductor device, a method of operating the semiconductor device, and a method of fabricating the semiconductor device are disclosed. The semiconductor device comprises a substrate stack comprising two permanently bonded semiconductor bodies stacked in a depth direction that points perpendicularly from a front side towards a back side of the substrate stack, and which share a buried bonding interface. One of the semiconductor bodies, the protection body, comprises an active region with a light emitter at the buried bonding interface, and a light absorption region which is opaque for light emitted from the light emitter. Another of the semiconductor bodies, the circuit body, extends from the buried bonding interface to the front side, is transmissive for the light emitted from the light emitter, and comprises a light detector at the front side to provide a detector signal indicative of a detected light intensity of light emitted from the light emitter and transmitted through the circuit body. A driver unit of the semiconductor device is configured to drive operation of the light emitters using predetermined operation parameters.

Growing community of inventors

Berlin, Germany

Elham Amini