Luminus Devices, Inc.

Massachusetts Institute of Technology

Rambus International Ltd.

The Nottingham Trent University

Nokia Technologies Oy

Elefterios Lidorikis

Alexei A Erchak

Chiyan Luo

Michael Hong Lim

Jo A Venezia

John W Graff

John Dimitris Joannopoulos

Robert F Karlicek, Jr

Marin Soljacic

Yoel Fink

Steven G Johnson

Mihai Ibanescu

Paul Joseph Panaccione

Christian Hoepfner

Nikolay I Nemchuk

Nikolay I Nemchuck

Aristeidis Karalis

Shanhui Fan

Alan Colli

Scott W Duncan

Jani Kivioja

Michelle L Povinelli

Erich P Ippen

Michael Gregory Brown

Milan Singh Minsky

Leslie Kolodziejski

Gale Petrich

Evan J Reed

Solomon Assefa

Demosthenes Koutsogeorgis

Panos Patsalas

Wayne Cranton

Reginald E Bryant

David Chan

Kerwyn C Huang

Andrea Ferrari

Tim Echtermeyer

A thin film comprising a layer of dielectric material having electrically conductive inclusions, wherein the thin film has a first reflectivity due to surface plasmon resonance, and wherein the thin film is configured to provide one or more selected regions having a second reflectivity due to surface plasmon resonance.

Surface plasmon resonance in thin films

Light-emitting devices, and related components, systems and methods are disclosed.

Large emission area light-emitting devices

Light emitting devices

Light emitting diode systems are disclosed.

Light emitting diode systems including optical display systems having a microdisplay

Electronic device contact structures are disclosed.

Electronic device contact structures

Light-emitting devices can include a package that supports one or more light-emitting die (e.g., light-emitting diode die, laser diode die) and which can ensure mechanically stability, can facilitate electrical and/or thermal coupling with light-emitting die, and can manipulate the manner by which light generated by the die is emitted out of the light-emitting device. The package can also facilitate the integration of the light-emitting devices in various components and systems. For example, suitable packages may facilitate the use of light-emitting devices in components and systems such as light-emitting panel assemblies, LCD back lighting, general lighting, decorative or display lighting, automotive lighting, and other types of lighting components and systems.

Light-emitting devices and related systems

Light-emitting devices

Light-emitting devices, and related components, systems and methods are disclosed. In some embodiments, the light-emitting devices include a multi-layer stack of materials. The stack of materials includes a light-generating region and a first layer supported by the light-generating region. The surface of the first layer is configured so that light generated by the light-generating region can emerge from the light-emitting device via the surface of the first layer. The surface has a dielectric function that varies spatially according to a nonperiodic pattern.

Light-emitting devices including a nonperiodic pattern

Light emitting diode systems are disclosed. An optical display system that includes a light emitting diode (LED) and a cooling system is disclosed. The cooling system is configured so that, during use, the cooling system regulates a temperature of the light emitting diode.

Light emitting diode systems

Light-emitting devices, and related components, processes, systems and methods are disclosed.

Packaging designs for LEDs

Electronic devices involving contact structures, and related components, systems and methods associated therewith are described. Contact structures (also referred to as electrical contact structures or electrodes) are features on a device that are electrically connected to a power source. The power source can provide current to the device via the contact structures. The contact structures can be designed to improve current distribution in electronic devices. For example, the contact resistance of the contacts may be modified to improve current distribution (e.g., by controlling the shape and/or structure and/or composition of the contacts). The contact structures may include an intervening layer (e.g., a non-ohmic layer) positioned between a surface of the device and a conductive portion extending from a conductive pad. The intervening layer and/or conductive portions may be designed to have certain shapes (e.g., non-linear shapes) that promote current flow from the conductive pad towards the ends of the contacts to increase current spreading. The intervening layer can also reduce light generation underneath the light absorbing contacts to allow a greater percentage of the generated light to emerge from the surface of the device. Advantageously, devices including contact structures of the invention can increase uniformity of light emission and/or otherwise improve performance. As such, these contact structures are particularly suitable for use in a variety of light-emitting devices, including LEDs.

Growing community of inventors

Ioannina, Greece

Elefterios Lidorikis