Intel Corporation

Eleanor Patricia Paras Rabadam

Tyler Leuten

Boping Xie

Israel Petronius

Kenneth Brown

Yi Xu

Ronald L Spreitzer

Sanjeev Gupta

Maria Angela Damille Ramiso

Daniel Grodensky

Jonathan Doylend

Sushrutha Gujjula

Stephen Keele

Nan Kong Ng

Sam Khalili

Gal Dvoretzki

Ron Friedman

Qifeng Wu

Guiyun Bai

Disclosed herein are light detection and ranging (LIDAR) systems and methods for manufacturing the same. The LIDAR systems may include microelectronics packages that may include a chassis, an insert, a photonic integrated circuit (PIC), and a lid. The chassis may define an opening. The insert is sized to be received in the opening. The insert is made of a thermally conductive material. The PIC is attached to the insert. The lid is connected to the chassis and defines a cavity that encases the PIC. Both the insert and the lid form thermally conductive pathways away from the PIC.

Silicon photonic systems for LIDAR applications

Integrated circuit assemblies may contain various mold, fill, and/or underfill materials. As these integrated circuit assemblies become ever smaller, it becomes challenging to prevent voids from forming within these materials, which may affect the reliability of the integrated circuit assemblies. Since integrated circuit assemblies are generally formed by electrically attaching integrated circuit dice on electronic substrates, the present description proposes injecting the mold, fill, and/or underfill materials through openings formed in the electronic substrate to fill voids that may form and/or to prevent the formation of the voids altogether.

Through-substrate void filling for an integrated circuit assembly

An integrated circuit assembly may be formed comprising a stepped electronic substrate having a first surface and an opposing second surface, wherein the first surface comprises a first surface portion or lower step and a second surface portion or upper step. At least one integrated circuit device may be electrically attached to the first surface portion of the first surface of the stepped electronic substrate and an anisotropic conductive layer on the second surface portion of the first surface of stepped electronic substrate. The anisotropic conductive layer may be used to electrically couple the integrated circuit assembly with an additional integrated circuit assembly.

Stepped electronic substrate for integrated circuit packages

Growing community of inventors

Folsom, CA, United States of America

Eleanor Patricia Paras Rabadam