Hewlett-packard Company

Eldurkar V Bhaskar

Marzio A Leban

Kenneth E Trueba

Ulrich E Hess

Marvin Glenn Wong

Paul H McClelland

Douglas A Sexton

James G Bearss

David E Hackleman

William R Knight

Ellen R Tappon

Niels J Nielsen

Kit C Baughman

Duane A Fasen

Peter M Burke

Michael D Angerstein

Zen Kurokawa

A pagewide printhead for an inkjet printer employs a stretch-to-fit flex circuit with orifices indexed to reference indentations on the flex circuit. Heater resistors disposed on a block of thermally stable insulating material are indexed to reference features accurately located on the block. The reference indentations are fitted to the reference indentations to provide accurate registration of the orifices to the heater resistors.

Large area inkjet printhead

An inkjet printhead structure comprises novel resistor circuitry that is fabricated on two different substrate layers. The dual layer circuitry reduces the required substrate surface area and printhead shelf length to increase the printer operating frequency and print density. In one embodiment of the invention, heating resistors are spread out over portions of the substrate surface area and conductors are attached to opposite ends of the heater resistors in a novel configuration. To simplify routing, the circuitry is configured so that multiple heater resistors are coupled to the same conductor return path located on a second conductive layer. In a second embodiment of the invention, the heater resistors are dimensioned in the shape of a trapezoid to provide uniform heating. Alternative resistor shapes are then introduced to provide consistent heat dissipation for variances in resistor/conductor sheet resistance.

Special geometry ink jet resistor for high dpi/high frequency structures

A printhead includes a substrate with an ink feed aperture extending from a first surface to a second surface and a plurality of heater resistors disposed on it. Primitive groupings of the resistors are coupled to associated group power sources. An ink barrier layer is deposited on the substrate to create ink firing chambers for each resistor. One wall of the ink barrier has a constricted opening through which ink is supplied from the ink feed aperture. A plurality of transistors are disposed in the substrate with each transistor output coupled to an associated one of the resistors and each input coupled to one of a plurality of addressing signal lines. The number of addressing signal lines is equal to the number of resistors in a primitive grouping.

Thermal inkjet printer printhead with offset heater resistors

A new and improved orifice or nozzle plate for an inkjet printhead and method of manufacture wherein the orifice or nozzle plate thickness has been increased significantly to a value on the order of 75 micrometers or greater while simultaneously maintaining the integrity of the convergent contour of the multiple orifice openings formed therein. In a first embodiment of this invention, metal layer stacking through the use of successive electroforming processes is used to achieve a desired orifice plate structure, architecture and convergent orifice geometry. In a second embodiment of this invention, anisotropic electroplating on a metal surface and over the edges of an inorganic dielectric mask is used to produce this orifice plate of increased orifice bore thickness and convergent orifice bore geometry. In yet a third embodiment of the invention, a selected metal is plated upon a permanent insulating mandrel having a metal pattern thereon to form convergent orifice openings in the plated metal. Openings are then formed in the insulating layer which are aligned with electroplated convergent openings in the metal layer to thereby form a composite metal-insulator orifice plate of increased thickness and overall convergent orifice bore geometry.

Thermal inkjet printhead orifice plate and method of manufacture

We describe an integrated thermal ink jet printhead and manufacturing process therefor which includes the successive build-up of an orifice plate, a first barrier layer, heater resistors, a second barrier layer, and an ink reservoir-defining layer on top of a reusable or 'dummy' substrate. Lead-in conductors are formed integral with the heater resistors by controlling the cross-sectional areas of these components, and openings (passageways) are formed between ink reservoirs and the orifice plate to provide for ink flow under control of the heater resistors. The dummy substrate is stripped away from the adjacent orifice plate, and the ink reservoir defining layer may be secured to an ink supply tank which supplies ink to the individual ink reservoirs. Thus, the orifice plate, heater resistors and ink flow paths of the printhead are self aligned, and the heater resistors are removed from direct cavitational forces from ink ejected from the orifice plate.

Integrated thermal ink jet printhead and method of manufacture

A process for forming a dielectric patterned layer of any desired geometry on a selected substrate which includes vapor depositing selected reactants on said substrate only in areas thereon which are coextensive with the surface area of an adjacent metal electrode pattern.

Process for producing patterns in dielectric layers formed by plasma

The specification describes thermal ink jet (TIJ) processes and device structures produced thereby wherein either heater resistors or heater resistor-diode combinations are constructed vertically upward from a common supporting substrate. A lower or first metal level conductor pattern provides one part of an X-Y matrix multiplex connection to the resistor/diode components, and a second, upper metal level conductor pattern forms the second part of the X-Y matrix multiplex connection. In this manner, the multiplex drive circuitry for the TIJ printhead resistors/diodes may be fabricated (integrated) directly on the thin film resistor (TFR) printhead substrate. Additionally, the second level metal conductors which overlie the resistive heater and diode elements also serve as a barrier shield to ink corrosion and cavitation wear.

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Corvallis, OR, United States of America

Eldurkar V Bhaskar