Intel Corporation

Elah Bozorg-Grayeli

Debendra Mallik

Ram S Viswanath

Je-Young Chang

Taylor W Gaines

Ahmad Al Mohammad

Sergio Antonio Chan Arguedas

Aravindha Antoniswamy

Kyle Jordan Arrington

Ken P Hackenberg

Frederick W Atadana

James Chris Matayabas, Jr

Nisha Ananthakrishnan

Amram Eitan

Kelly P Lofgreen

Joseph B Petrini

Suzana Prstic

Aaron McCann

Sivakumar Nagarajan

Liwei Wang

Venmathy McMahan

Robert F Cheney

Craig Jonathan Weinman

Amrita Mallik

Sachin Deshmukh

Enisa Harris

Kuang-Han Chu

Michael Greenley

Marely E Tejeda Ferrari

Muhammad S Islam

Craig J Weinman

Thermal heat spreaders and/or an IC die with solderable thermal structures may be assembled together with a solder array thermal interconnects. A thermal heat spreader may include a non-metallic material and one or more metallized surfaces suitable for bonding to a solder alloy employed as thermal interface material between the heat spreader and an IC die. An IC die may include a metallized back-side surface similarly suitable for bonding to a thermal interconnect comprising a solder alloy. Metallization on the IC die and/or heat spreader may comprise a plurality of solderable structures. A multi-chip package may include multiple IC die having different die thickness that are accommodated by a z-height thickness variation in the thermal interconnects and/or the solderable structures of the IC die or heat spreader.

IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnects

IC die and heat spreaders with solderable thermal interface structures for assemblies including solder array thermal interconnects

Disclosed herein are integrated circuit (IC) package lids with polymer features, as well as related methods and devices. For example, in some embodiments, an IC package may include a package substrate, a lid, and a die between the package substrate and the lid. A foot or rib of the lid may include a polymer material.

Integrated circuit package lids with polymer features

IC die with solderable thermal interface structures for assemblies including solder array thermal interconnects

Microelectronic devices, assemblies, and systems include a microelectronic die and composite material to conduct heat from the microelectronic die such that the composite material includes polymer chains chemically bonded to fill particles having a hexagonal lattice of carbon atoms such as graphene sheet fill particles and/or carbon nanotube fill particles.

Carbon based polymer thermal interface materials with polymer chain to carbon based fill particle bonds

A second-level thermal interface material (TIM2) that is to couple to a system-level thermal solution is applied to an integrated circuit (IC) assembly comprising an IC die and an assembly substrate prior to the assembly substrate being joined to a host component at the system-level. Challenges associated with TIM2 application may therefore be addressed at a first level of IC die integration, simplifying subsequent assembly and better controlling thermal coupling to a subsequently applied thermal solution. Where a first-level IC assembly includes a stiffener, the TIM may be affixed to the stiffener through an adhesive bond or a fusion bond. After the IC assembly including the TIM is soldered to the host board, a thermal solution may be placed in contact with the TIM. With early application of a solder TIM, a solder TIM may be reflowed upon the IC die multiple times.

First-level integration of second-level thermal interface material for integrated circuit assemblies

A thermal interface structure may be formed comprising a thermally conductive substrate having a first surface and an opposing second surface, a first liquid metal layer on the first surface of the thermally conductive substrate, and a second liquid metal layer on the second surface of the thermally conductive substrate. The thermal interface structure may be used in an integrated circuit assembly or package between at least one integrated circuit device and a heat dissipation device.

Thermal interface structures for integrated circuit packages

Embodiments may relate to a method of forming a microelectronic package with an integrated heat spreader (IHS). The method may include placing a solder thermal interface material (STIM) layer on a face of a die that is coupled with a package substrate; coupling the IHS with the STIM layer and the package substrate such that the STIM is between the IHS and the die; performing formic acid fluxing of the IHS, STIM layer, and die; and dispensing, subsequent to the formic acid fluxing, sealant on the package substrate around a periphery of the IHS.

Microelectronic package with underfilled sealant

Embodiments may relate to a microelectronic package that includes an integrated heat spreader (IHS) coupled with a package substrate. The microelectronic package may further include a sealant material between the package substrate and the IHS. The sealant material may be formed of a material that cures when exposed to ultraviolet (UV) wavelengths. Other embodiments may be described or claimed.

Ultraviolet (UV)-curable sealant in a microelectronic package

A multi-chip package includes multiple IC die interconnected to a package substrate. An integrated heat spreader (IHS) is located over one or more primary IC die, but is absent from over one or more secondary IC die. Thermal cross-talk between IC dies and/or thermal performance of individual IC dies may be improved by constraining the dimensions of the IHS to be over less than all IC die of the package. A first thermal interface material (TIM) may be between the IHS and the primary IC die, but absent from over the secondary IC die. A second TIM may be between a heat sink and the IHS and also between the heat sink and the secondary IC die. The heat sink may be segmented, or have a non-planarity to accommodate differences in z-height across the IC die and/or as a result of constraining the dimensions of the IHS to be over less than all IC die.

Multi-chip package with partial integrated heat spreader

Embodiments herein relate to curing of an epoxy using an ultraviolet (UV) laser. A volume of epoxy may be coupled to an area of a surface, and the volume of epoxy is cured and surrounded by material other than cured epoxy, where the area of the surface is substantially equal to a diameter of the UV laser beam used to cure the epoxy. Other embodiments may be described and/or claimed.

Substrate with epoxy cured by ultraviolet laser

Some embodiments relate to an electronic package. The electronic package includes a first die and a second die stacked onto the first die. A first encapsulant is positioned between the first die and the second die. The first encapsulant includes a first material that covers a first volume between the first die and the second die. A second encapsulant is positioned between the first die and the second die. The second encapsulant includes a second material that covers a second volume between the first die and the second die. The first material has a higher thermal conductivity than the second material, and the second material more effectively promotes electrical connections between the first die and the second die as compared to the first material.

Two material high K thermal encapsulant system

Growing community of inventors

Chandler, AZ, United States of America

Elah Bozorg-Grayeli