General Electric Company

Lockheed Martin Corporation

Ge Precision Healthcare LLC

Ge Infrastructure Technology, LLC

General Electric Renovables Espana, S.l.

Eladio Clemente Delgado

Ertugrul Berkcan

Emad Andarawis Andarawis

Richard Alfred Beaupre

Charles Erklin Seeley

Robert J Wojnarowski

Samantha Rao

Brian Lynn Rowden

Paul Alan McConnelee

Michael Andrew De Rooij

Mustansir Hussainy Kheraluwala

Stephen Daley Arthur

John Stanley Glaser

Juan Antonio Sabate

Ljubisa Dragoljub Stevanovic

Ernest Wayne Balch

Christopher James Kapusta

Kevin Matthew Durocher

Raymond Albert Fillion

Charles S Korman

Burhan Ozmat

Nanette Gruber

C Scott Sealing

Richard H Coulter

John Erik Hershey

Robert Louis Steigerwald

Richard J Saia

Arun Virupaksha Gowda

Thomas Bert Gorczyca

Antonio Caiafa

Glenn Scott Claydon

Ruxi Wang

David F Johnston

Michael Joseph Schutten

William Edward Burdick, Jr

Harold Woodruff Tomlinson, Jr

Samhita Dasgupta

Darren John Danielsen

Joseph Lucian Smolenski

Zhiyuan Ren

Fengfeng Tao

John Yupeng Gui

Terry Lewis Farmer

Timothy Lee Johnson

Charles Scott Sealing

David Cecil Hays

Melissa Freeman

Randy Otto John Giaquinto

Douglas John Link

David R Darling

Percy N Funchess, Iii

Logan Sproull Snow

Ertugrul Berkan

Robert John Wojnarowski

Nanette Judith Gruber

Emad Anadarawis Andarawis

A system and method include with a mass damper for reducing vibrations in a structure or machine. The mass damper includes a frame that is movable linearly along a base, which includes a track gear. A flywheel is in geared engagement with the track gear so as to be rotationally driven as the frame moves linearly relative to the base. A rotation damper is mounted on the frame and is geared engagement with the flywheel, the rotation damper producing a counter-torque against rotation of the flywheel that is proportional to a rotational velocity of the flywheel. The rotation damper has an electrical characteristic that is automatically adjusted to change the counter-torque and tune the mass damper.

Automatically tunable mass damper

A gate driver circuit includes an isolated gate driver power supply circuit. The isolated gate driver power supply circuit includes a coreless transformer including a primary winding and a secondary winding. The secondary winding is wound about a toroid-shaped, non-magnetic body and the primary winding is a single turn primary winding to reduce capacitance coupling between the primary winding and the secondary winding. The isolated gate driver power supply circuit also includes a resonance converter coupled to the coreless transformer, wherein the resonance converter is configured to enable the isolated gate driver power supply circuit to generate an output voltage independent of load.

Gate driver coreless transformers for magnetic resonance imaging power electronics

A system and method are provided for reducing vibrations and loads in one or more rotor blades on a rotor hub of a wind turbine when the rotor hub is in a locked or idling condition. An electronically tunable spring mass damper is attached to a fixed location on one or more of the rotor blades. The spring mass damper is maintained on the rotor blades during the locked or idling condition of the rotor hub. The method includes sensing movement of the mass component resulting from the vibrations induced in the blade. Based on the sensed movement of the mass component, the spring mass damper is automatically tuned to the amplitude of the vibrations by operating the electric machine as a generator in a virtual damper mode and/or tuned to the frequency of the vibrations by operating the electrical machine as a motor-generator in a virtual spring mode.

System and method for use of an automatically tunable spring mass damper to reduce vibrations in wind turbine blades

A system and method are provided for reducing vibrations and loads in one or more rotor blades on a rotor hub of a wind turbine when the rotor hub is in a locked or idling condition. An electronically tunable mass damper is attached to a fixed location on one or more of the rotor blades. The mass damper is maintained on the rotor blades during the locked or idling condition of the rotor hub. The method includes sensing movement of a mass component of the mass damper from vibrations or oscillations induced in the rotor blade. The mass damper is automatically tuned based on the sensed movements of the mass component by automatically varying an electrical characteristic of the mass damper.

System and method for use of a tunable mass damper to reduce vibrations in wind turbine blades in a locked or idling condition of the rotor hub

The present disclosure presents techniques to facilitate improving operation of an electrical system, which includes a bus structure that cascades multiple electrical devices. The bus structure includes a first outer conductive layer implemented as a positive layer; a second outer conductive layer implemented as a negative layer; a first intermediate conductive layer neighboring the first outer conductive layer; a second intermediate conductive layer neighboring the second outer conductive layer; and a third intermediate conductive layer neighboring the second intermediate conductive layer, in which the third intermediate conductive layer is implemented as an inter-device layer that facilitates electrically coupling at least two of the electrical devices in series. The first intermediate conductive layer is implemented as a negative layer and the second intermediate conductive layer is implemented as a positive layer to facilitate reducing stray inductance and/or increasing stray capacitance introduced in the electrical system during operation.

Cascaded electrical device bus structure systems and methods

A surface mount package includes at least one semiconductor device and a POL packaging and interconnect system formed about the at least one semiconductor device that is configured enable mounting of the surface mount package to an external circuit. The POL system includes a dielectric layer overlying a first surface of the semiconductor device(s) and a metal interconnect structure extending through vias formed through the dielectric layer so as to be electrically coupled to connection pads on the semiconductor device(s). A metallization layer is formed over the metal interconnect structure that comprises a flat planar structure, and a double-sided ceramic substrate is positioned on a second surface of the semiconductor device(s), with the double-sided ceramic substrate being configured to electrically isolate a drain of the semiconductor device(s) from an external circuit when the surface mount package is joined thereto and to conduct heat away from the semiconductor device(s).

Low profile surface mount package with isolated tab

An integrated power module includes a substantially planar insulated metal substrate having at least one cut-out region; at least one substantially planar ceramic substrate disposed within the cut-out region, wherein the ceramic substrate is framed on at least two sides by the insulated metal substrate, the ceramic substrate including a first metal layer on a first side and a second metal layer on a second side; at least one power semiconductor device coupled to the first side of the ceramic substrate; at least one control device coupled to a first surface of the insulated metal substrate; a power overlay electrically connecting the at least one semiconductor power device and the at least one control device; and a cooling fluid reservoir operatively connected to the second metal layer of the at least one ceramic substrate, wherein a plurality of cooling fluid passages are provided in the cooling fluid reservoir.

Power module package

Integrated power module package

A monitoring system for monitoring one or more operating conditions of a structure such as an aircraft, method of operating a system for monitoring one or more operating conditions of the structure, and a sensor node for use in a monitoring system for monitoring one or more operating conditions of the structure, are provided. An example of a monitoring system can include a plurality of sensor nodes coupled to the structure and a controller for monitoring the sensor nodes. Each sensor node can include a communications interface including memory storing a plurality of sensor node communication protocol attributes used for communicating with the controller.

Methods for anti-collision and multiple access in RFID communications

A power-converting apparatus, such as a power module, may include a base plate (), a first direct current (DC) bus and a second DC bus (). A power semiconductor component () may be electrically coupled to one of the buses, and may be disposed on a substrate () physically coupled to the base plate. The power semiconductor component may be made from a high-temperature, wide bandgap material, and the substrate may be exposed to a heat flux based on an operational temperature of the power semiconductor component. At least a first capacitor () may be coupled across the first and second DC buses, and at least second and third capacitors () may be respectively coupled across respective ones of the first and second buses and an alternating current (AC) return path. Capacitors () may each be located inside the power module to establish circuit connections sufficiently proximate to the first power semiconductor component to reduce a formation of parasitic inductances, and further may each be located physically apart from the substrate and thus not exposed to the heat flux.

Power converting apparatus having improved electro-thermal characteristics

A flexible power connector is presented. An embodiment of a flexible power connector includes a stacked structure having one or more insulating strips alternatingly arranged with a plurality of conducting strips, wherein the one or more insulating strips are interposed between the plurality of conducting strips to insulate each conducting strip from the other conducting strip in the stacked structure, and wherein the plurality of conducting strips is disposed parallel and proximate to each other to reduce electrical losses in the stacked structure

Flexible power connector

An identification system and method comprising attaching an identification tag to an inside surface of a shipping container port cover and communicating data from the tag via electromagnetic radiation.

Unobtrusive proprioceptive monitor for shipping containers and vehicles

A power module includes at least one semiconductor die holding structure. Each die holding structure has a substantially cylindrical outer profile and a central axis. Each die holding structure is disposed within a common cylindrical EMI shield. A plurality of semiconductor devices are mounted to each die holding structure to form a substantially symmetric die mounting pattern respect to the central axis of the die holding structure.

Coaxial power module

A power semiconductor module includes: an interconnect layer including an electrical conductor patterned on a dielectric layer, the electrical conductor including a power coupling portion having a thickness sufficient to carry power currents and a control coupling portion having a thickness thinner than that of the power coupling portion; and a semiconductor power device physically coupled to the interconnect layer and electrically coupled to the power coupling portion of the electrical conductor.

Power semiconductor module and fabrication method

Growing community of inventors

Burnt Hills, NY, United States of America

Eladio Clemente Delgado