Mitsui Kinzoku Kogyo Kabushiki Kaisha

Hitachi Shipbuilding and Engineering Co., Ltd.

Eizo Ishikawa

Takusen Ito

Masami Murakami

Keiichi Otsuka

A blank material for use as a ceramic wiring substrate of this invention is prepared by laminating a copper foil onto a ceramic base formed from a boron nitride sintered body or the like via a bonding layer interposed therebetween, and incoporating an inorganic filler in at least the ceramic base-containing side of the bonding layer. A fine and high density circuit substrate can be easily formed from the ceramic wiring substrate blank material according to the present invention by a conventional etching method.

Ceramic wiring substrate blank material and process for production

A conduit for feeding a combustible waste gas to a ground flare is divided into a plurality of branch pipes each connected to burners of the ground flare. A stop valve is mounted on each of the branch pipes except the first pipe and provided with a limit switch for detecting the closing of the valve. A pressure detector is mounted on each of the branch pipes except the last pipe. The valve on each branch pipe opens in response to an opening signal from the pressure detector on the preceding branch pipe and closes in response to both a closing signal from that pressure detector and a signal from the limit switch on the valve on the following branch pipe, whereby the number of branch pipes used for feeding the waste gas is controlled in accordance with variations in the feed of waste gas.

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Ibaraki, Japan

Eizo Ishikawa