Canon Anelva Corporation

Eitaroh Morimoto

Naomu Kitano

Koji Yamazaki

Takuya Seino

Yu Sato

Akira Matsuo

Yohsuke Shibuya

It is an object of the present invention to provide an electronic component manufacturing method, capable of suppressing reduction in a trench opening and suppressing diffusion of a metal film embedded in a trench. An embodiment of the present invention is an electronic component manufacturing method, including the steps of: forming a first electrode constituting layer (e.g., a TiAl film) in a recess (e.g., a trench) formed in a workpiece; forming an ultrathin barrier layer (e.g., a TiAlN film) by forming a nitride layer by plasma-nitriding a surface of the first electrode constituting layer; and forming a second electrode constituting layer (e.g., an Al wiring layer) on the ultrathin barrier layer.

Growing community of inventors

Kawasaki, Japan

Eitaroh Morimoto