Murata Manufacturing Co., Ltd.

Eitaro Kameda

Hiroaki Kaida

Keisuke Takeyama

Katsumi Fujimoto

Daisuke Nakamura

Toshiyuki Baba

Akihiro Mitani

Toru Kizu

Jiro Inoue

Toshio Nishimura

Toshihiko Unami

Shoichi Kawabata

Hiroshi Nakatani

Chikahiro Horiguchi

Makoto Kitamura

Toshiaki Yamashita

Hideaki Kuroda

Yuji Fujino

Toshiki Nishiwaki

Yasuhiro Morimoto

A piezoelectric resonator unit that includes a base, a cover, and a laminated structure disposed between the base and the cover. The laminated structure includes a piezoelectric resonator having a piezoelectric layer with a pair of principal surfaces facing each other, and a pair of excitation electrodes disposed on respective surfaces of the pair of principal surfaces so as to face each other with the piezoelectric layer therebetween, a semiconductor layer laminated on a side of one of the pair of principal surfaces of the piezoelectric layer, and a pair of measurement electrodes provided on the semiconductor layer. The pair of measurement electrodes measure signals based on temperature of the piezoelectric resonator through the semiconductor layer.

Piezoelectric resonator unit and oscillator provided with the same

An analysis device that includes a piezoelectric substrate having a pair of opposing principal surfaces; a groove disposed in one of the principal surfaces of the piezoelectric substrate and that forms a flow passage through which an analysis target flows; a first electrode disposed in at least a portion of a space inside the groove; and a second electrode disposed on another of the principal surfaces of the piezoelectric substrate so as to oppose the first electrode with the piezoelectric substrate disposed therebetween. A projection projects from a bottom surface of the groove, and at least one of the first electrode and an adsorption material is provided in a region extending from the bottom surface of the groove portion to a side surface of the projection.

Analysis device

A MEMS device that suppresses variations in a resistance value caused by contracting vibrations in a direction in which a holding portion extends. The MEMS device includes a frame, a rectangular plate that receives an input of a driving signal, and holding portions that anchor the rectangular plate to the frame. The frame and the rectangular plate are both rectangular in shape. The holding portions are provided extending toward the frame from central areas of the opposing sides of the rectangular plate, and anchor the rectangular plate to the frame. A resistive film is formed in a region that follows a straight line connecting the holding portions that anchor the rectangular plate to the frame and that corresponds to no more than half a maximum displacement from a vibration distribution.

MEMS device

A frequency adjustment method is provided in which a residual substance is unlikely to be generated, the frequency can be adjusted with high precision, and a decrease in strength is made small. A frequency adjustment method for a piezoelectric vibrator includes preparing the piezoelectric vibrator having a base portion, a vibration arm that includes a connection portion connected to the base portion as well as vibration arm main bodies extending from the connection portion and that is made of a single crystal, a lower electrode formed on the vibration arm, a piezoelectric thin film formed on the lower electrode, and an upper electrode formed on the piezoelectric thin film; and forming an alteration portion by irradiating the connection portion with a laser beam.

Piezoelectric vibrator and frequency adjustment method for piezoelectric vibrator

A piezoelectric vibrator that includes a piezoelectric film with a pair of electrodes disposed on opposing sides of the piezoelectric film. Moreover, the vibrator includes first and second adjustment films with the first adjustment film covering the first surface of the piezoelectric film in a first region and the second adjustment film covering the first surface of the piezoelectric film in a second region that is different from the first region. Moreover, the second region of the piezoelectric film has a greater displacement than the first region when the piezoelectric vibrator vibrates.

Piezoelectric vibrator and piezoelectric vibrating apparatus

A piezoelectric power generating device that includes a piezoelectric element having a first surface and a second surface opposite the first surface, a stopper, and a lever. The stopper has a first contact surface that is in contact with the first surface. The lever includes a contact portion, which includes a second contact surface that is in contact with the second surface, and a displacement portion. The lever is arranged in such a manner as to be rotatable relative to the stopper around a rotation axis such that the second contact surface presses the second surface when the displacement portion rotates relative to the stopper around the rotation axis.

Piezoelectric power generating device having a stress applying member

A piezoelectric power generator that includes a first elastic body, which deforms along a first direction x upon receiving a stress, and a piezoelectric power-generating element. A second elastic body is arranged on a y1 side of the first elastic body and a piezoelectric element is fixed to a y1-side surface of the second elastic body. When the first elastic body bends into a shape that is concave toward the y1 side, the second elastic body receives a stress from the first elastic body. When the first elastic body bends into a shape that is convex toward the y1 side, the second elastic body does not receive a stress from the first elastic body. The piezoelectric power generator further includes a vibration suppressing member that is arranged between the first elastic body and the second elastic body and suppresses bending mode vibration of the second elastic body.

Piezoelectric power generator

To obtain an inexpensive piezoelectric vibration component having vibration characteristics whose degradation resulting from deposition of moisture due to a temperature change is less likely to occur without increasing the cost of a sealing structure and the number of parts, a piezoelectric vibration component includes a piezoelectric vibrating element accommodated in a package being sealed, and when the volume of the piezoelectric vibrating element is Ve and the volume within the package obtained by subtraction of the volume Ve of the piezoelectric vibrator from the volume of the space of the package is Vp&#x3e;()/{()&#xd7;2.72}where Se is the surface area of the piezoelectric vibrating element, Sp is the surface area of the space inside the package when the piezoelectric vibrating element inside the package is absent, and M is the maximum mass of moisture per unit volume [&#x3bc;g/mm] at the use temperature and 100% relative humidity.

Piezoelectric vibration component

A piezoelectric power generator having a first elastic body which deforms along a first direction when subject to a stress, and a power-generating element. The power-generating element includes a second elastic body and a piezoelectric element. The second elastic body includes a fixing portion and an abutting portion. The fixing portion is fixed to the first elastic body. The abutting portion is arranged on one side in a first direction with respect to the fixing portion. The abutting portion abuts against the first elastic body, but is not fixed to the first elastic body. At least one of the first elastic body and the second elastic body is provided with a slippage suppression mechanism that suppresses slipping of the abutting portion with respect to the first elastic body when the first elastic body is deformed.

A piezoelectric oscillator part capable of suppressing oscillation that leaks from a piezoelectric oscillator to a substrate side is obtained. The piezoelectric oscillator part has a piezoelectric oscillator held on a substrate by first and second conductive holding members. The first conductive holding member is arranged proximal to a first end of the substrate. A terminal electrode connected to the first conductive holding member is arranged proximal to a second end of the substrate opposite the first end. The first conductive holding member and the terminal electrode are electrically connected by a wiring electrode.

Piezoelectric oscillator part

A surface mount type electronic component includes a substantially rectangular case substrate, an electronic element mounted on the case substrate along the longitudinal direction, and a cap which is fixed onto the case substrate in such a manner as to cover the electronic element. First and second top-surface electrodes and first and second bottom-surface electrodes, which extend along the width direction of the case substrate, are arranged with a spacing on the top surface and the bottom surface of the case substrate, respectively. The first top-surface electrode and the first bottom-surface electrode are connected to each other via a first side electrode disposed on the side surface of the case substrate, and the second top-surface electrode and the second bottom-surface electrode are connected to each other via a second side electrode disposed on the side surface of the case substrate.

Surface mount type electronic component

A piezoelectric resonance component includes a capacitor substrate, a piezoelectric resonator mounted on the capacitor substrate, and a cover member fixedly attached to the capacitor substrate. The capacitor substrate includes a dielectric substrate, a plurality of inner electrodes arranged in layers within the dielectric substrate, and a plurality of outer electrodes disposed on at least one of opposed side surfaces of the dielectric substrate. The plurality of inner electrodes include an inner electrode to be connected to a ground potential and a pair of split inner electrodes located at a common vertical position and spaced apart from each other with respect to a central portion of the dielectric substrate.

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Nagaokakyo, Japan

Eitaro Kameda