Mitsubishi Gas Chemical Company, Inc.

Audio-technica Corporation

Eisuke Shiga

Katsuya Tomizawa

Meguru Ito

Tomo Chiba

Yoichi Takano

Hiroshi Takahashi

Ryosuke Shimizu

Nobuyoshi Ohnishi

Katsuyuki Oshima

Tomoki Hamajima

Yoshihiro Kato

Takaaki Ogashiwa

Naoki Kashima

Takashi Kubo

Kentaro Takano

Shohei Yamaguchi

Keisuke Takada

Daisuke Ueyama

Kentaro Nomizu

Shota Koga

Tomoe Morishita

A resin composition comprising a maleimide compound, a cyanate ester compound, a silane compound having a styrene skeleton and a hydrolyzable group or a hydroxy group, and an inorganic filler.

Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board

Display screen or portion thereof with graphical user interface

A resin composition that includes a maleimide compound, an alkenyl-substituted nadimide, a silane compound having a styrene skeleton and a hydrolyzable group or a hydroxy group, and an inorganic filler.

A resin composition comprising a thermosetting resin, a functional group-modified copolymer, and an inorganic filler, wherein the functional group-modified copolymer has two or more alkyl (meth)acrylate units, or one or two or more alkyl (meth)acrylate units and an acrylonitrile unit, and at least a part of alkyl ester groups of the alkyl (meth)acrylate units and/or a cyano group of the acrylonitrile unit are/is modified with at least one selected from the group consisting of an epoxy group, a carboxyl group, and an amide group.

Resin composition, prepreg, metal foil-clad laminate, and printed circuit board

It is intended to provide a resin composition that suppresses the thermal expansion of a printed circuit board more than ever and also prevents the bleedout of substances from the printed circuit board, while maintaining a high glass transition temperature. The resin composition of the present invention contains an alkenyl-substituted nadimide, a maleimide compound, and an epoxy-modified cyclic silicone compound.

A prepreg including: a thermosetting resin composition (C) containing a thermosetting resin (A) and an inorganic filler (B); and a glass cloth (D) impregnated or coated with the thermosetting resin composition (C);

Prepreg, metal foil-clad laminate, and printed wiring board

The present invention provides a resin composition containing an alkenyl-substituted nadimide and a perinone-based colorant, wherein the content of the perinone-based colorant is 0.8 parts by mass or less based on 100 parts by mass in total of resin-constituting components in the resin composition.

Resin composition and prepreg, resin sheet, laminate, and printed circuit board comprising same

The resin composition of the present invention comprises a prepolymer (P) and a thermosetting component, the prepolymer (P) being obtained by polymerizing an alkenyl-substituted nadimide (A), a maleimide compound (B), and an amino-modified silicone (C).

Resin composition, prepreg or resin sheet comprising the resin composition, and laminate and printed circuit board comprising them

The resin composition of the present invention comprises an alkenyl-substituted nadimide (A), a maleimide compound (B), and an amino-modified silicone (C).

It is intended to provide a resin composition that serves as a raw material for a printed circuit board excellent in heat resistance after moisture absorption and is excellent in moldability. The resin composition of the present invention contains a maleimide compound, a silane compound having a carbon-carbon unsaturated bond and a hydrolyzable group or a hydroxy group, a silane compound having an epoxy skeleton and a hydrolyzable group or a hydroxy group, and an inorganic filler.

A resin composition containing a compound represented by the following general formula (a) or the following general formula (b), an alkenyl-substituted nadimide compound, and a maleimide compound: wherein Rrepresents a group represented by the following general formula (c), 

Resin composition and prepreg, resin sheet, laminate, and printed circuit board

The present invention provides a resin composition containing an allyl group-containing compound (A) and a maleimide compound (B), in which the allyl group-containing compound (A) has a reactive functional group other than an allyl group.

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Tokyo, Japan

Eisuke Shiga