Canon Kabushiki Kaisha

Hitachi-kokusai Electric Inc.

Kokusai Electric Corporation

Kokusai Electric Co., Ltd.

Eisuke Nishitani

Seiichiro Karita

Shingo Okushima

Takatsuna Aoki

Noriyasu Nagai

Koichiro Nakazawa

Takumi Otani

Keiichirou Takeuchi

Yumi Komamiya

Yoshiyuki Nakagawa

Fumihiro Goto

Toru Yamane

Tomoyuki Inoue

Akira Morita

Kanako Soma

Katsuhisa Kasanami

Yoshiaki Murayama

Masaki Nitta

Naoto Sasagawa

Ryota Kashu

Rinako Kameshima

Akira Yamamoto

Kazuhiro Yamada

Satoshi Okada

Akio Saito

Ken Tsuchii

Shuzo Iwanaga

Takao Ogata

Tsukasa Kamakura

Zentaro Tamenaga

Shun Matsui

Toshimori Miyakoshi

Tatsurou Mori

Kazuhiro Morimitsu

Takayuki Sekine

Shinya Sasaki

Naoko Matsuyama

Michiko Nishiwaki

Minoru Teshigawara

Naofumi Ohashi

Masanori Sakai

Atsushi Sakamoto

Tadashi Takasaki

Takafumi Sasaki

Hideharu Itatani

Kenji Yabe

Yuji Takebayashi

Takuto Moriguchi

Hirohisa Yamazaki

Tetsuo Yamamoto

Kazuhiro Nakagomi

Hironobu Miya

Toshimitsu Miyata

Mitsuro Tanabe

Masanao Fukuda

Kazuhito Ikeda

Harunobu Sakuma

Minoru Inoue

Toshinori Shibata

Tetsuya Wada

A liquid ejection head includes an ejection opening; a passage in which an energy generation element is disposed; an ejection opening portion that allows communication between the ejection opening and the passage; a supply passage for allowing the liquid to flow into the passage; and an outflow passage for allowing the liquid to flow out to the outside. An expression of H×P×W>1.7 is satisfied when a height of the passage is set to H [μm], a length of the ejection opening portion is set to P [μm], and a length of the ejection opening portion is set to W [μm].

Liquid ejection head, liquid ejection apparatus, and method of supplying liquid

A liquid ejection head includes an ejection opening; a passage in which an energy generation element is disposed; an ejection opening portion that allows communication between the ejection opening and the passage; a supply passage for allowing the liquid to flow into the passage; and an outflow passage for allowing the liquid to flow out to the outside. An expression of H&#xd7;P&#xd7;W&#x3e;is satisfied when a height of the passage is set to H [&#x3bc;m], a length of the ejection opening portion is set to P [&#x3bc;m], and a length of the ejection opening portion is set to W [&#x3bc;m].

Provided is a liquid ejection head comprising: an ejection opening row along a first direction; a pressure chamber with print-element; a passage communicating with the pressure chamber; a supply opening row along the first direction with supply openings extending in a second direction to supply liquid to the passage; a collection opening row along the first direction with collection openings extending in the second direction to collect a liquid from the passage; a first common supply passage along the first direction to supply a liquid to the supply opening row; a first common collection passage along the first direction to collect a liquid from the collection opening row; a first supply side communication opening extending in the second direction to supply a liquid to the first common supply passage; and a first collection side communication opening extending in the second direction to collect a liquid from the first common collection passage, wherein at least one of the first supply side communication opening and the first collection side communication opening is provided at a plurality of positions.

Liquid ejection head and liquid ejection apparatus

Described herein is a technique capable of improving a quality of a substrate processing. According to one aspect of the technique described herein, there is provided a method of manufacturing a semiconductor device including: (a) receiving substrate data including at least one of a stacked number of layers of a device formed on a substrate and a structure of the device; (b) setting an apparatus parameter corresponding to the substrate data; (c) supporting the substrate corresponding to the substrate data above a substrate support; (d) elevating a temperature of the substrate based on the apparatus parameter while the substrate is separated from a surface of the substrate support; (e) placing the substrate on the substrate support after (d); and (f) processing the substrate in a process chamber.

Method of manufacturing semiconductor device and non-transitory computer-readable recording medium capable of adjusting substrate temperature

A liquid ejection head includes an ejection opening; a passage in which an energy generation element is disposed; an ejection opening portion that allows communication between the ejection opening and the passage; a supply passage for allowing the liquid to flow into the passage; and an outflow passage for allowing the liquid to flow out to the outside. An expression of H&#xd7;P&#xd7;W&#x3e;1.7 is satisfied when a height of the passage is set to H, a length of the ejection opening portion is set to P, and a length of the ejection opening portion is set to W.

There is provided a technique that includes supplying a first process gas to a process space where a substrate is accommodated, and using an inert gas as a carrier gas of the first process gas; and supplying plasma of a second process gas to the process space where the substrate is accommodated, and using an active auxiliary gas as a carrier gas of the second process gas.

Method of manufacturing semiconductor device

A printing mode for performing printing to a printing medium and a determination mode for determining the application amount of a reaction liquid to a discharge medium can be performed. In the determination mode, a reaction liquid application unit forms a layer of the reaction liquid on the discharge medium, and then an ink application unit applies an ink onto a part of the layer to form a test pattern to be utilized for the determination. In the formation of the test pattern, an image to be formed by the ink by the aggregation of a solid content in the applied ink partially moves and shrinks on the layer of the reaction liquid to be thereby deformed with a grade according to the applied reaction liquid.

Printing apparatus and printing method

An ink jet recording apparatus of the present invention includes an image forming unit which forms an ink image by discharging and applying ink containing at least a resin and a liquid component as an ink droplet onto a transfer body, a liquid removing unit which removes the liquid component in the ink image, a transfer unit which transfers removes the image, from which the liquid component is removed, onto a recording medium, a fixing unit which performs heating and pressing fixing on the image formed on the recording medium by pressing a fixing substrate, a liquid adhesion determination unit which determines whether a liquid adheres to a surface of the fixing substrate, and a liquid removing condition changing unit which changes a liquid removing condition of the liquid removing unit based on the determination result of the liquid adhesion determination unit.

Ink jet recording method and ink jet recording apparatus

A recording apparatus includes an ink application unit configured to apply ink to a transfer body, a first application unit configured to apply a first treatment liquid over an area on the transfer body, a second application unit configured to apply a second treatment liquid to the transfer body, a heating unit configured to heat the second treatment liquid applied to the transfer body, and a transfer unit configured to transfer the ink image, wherein a ratio of the second treatment liquid to the first treatment liquid on an outside of ink portion is determined according to the recording medium.

Recording apparatus and recording method

A printing apparatus having an ink application unit applying a first ink containing at least resin as a solid content onto a discharge medium, a reaction liquid application unit applying a reaction liquid reacting with a component in the ink to aggregate the solid content in the first ink onto the discharge medium, and a liquid absorbing unit for bringing a liquid absorbing member of a porous body into contact with an ink image formed by the ink and the reaction liquid on the discharge medium to absorb liquid to thereby reduce the amount of the liquid in the ink image, in which a layer is formed with the first ink and the reaction liquid on the discharge medium, and then a test pattern utilized for detection is printed by applying a second ink different from the first ink to a part of the layer by the ink application unit.

Provided is a highly reliable ink jet recording apparatus capable of preventing the occurrence of image defects. The ink jet recording apparatus includes a liquid absorbing device including a porous body configured to absorb/remove an aqueous liquid component from an image containing the aqueous liquid component and a coloring material, a heat drying device configured to perform a heat drying treatment of the image after being subjected to the liquid absorption treatment, a temperature measuring device configured to measure the temperature of the image after being subjected to the heat drying treatment with the heat drying device, and a determination unit configured to determine the state of the liquid absorbing device from the measured temperature.

Ink jet recording apparatus

Growing community of inventors

Tokyo, Japan

Eisuke Nishitani