Kawasaki Jukogyo Kabushiki Kaisha

New Japan Radio Co., Ltd.

Eisuke Mori

Shigetomo Matsui

Yoshio Fujii

Hideki Muto

Toshio Atsuta

Takeshi Yamada

Shinji Hara

Fumiyoshi Kanatani

Toshiaki Araki

A circuit package having an inner lead, an outer lead and a circuit element is provided, in which the circuit element is connected a first surface of the inner lead. The circuit package has a first molded resin portion and second molded resin portions. The first molded resin portion is formed from a second surface, opposite to the first surface, of the inner lead toward the first surface inner lead embedding the inner lead and the circuit element. And the second molded resin portions are formed on side portions of the outer lead excluding the first and second surfaces of the outer lead.

Lead built-in type circuit package and method for producing same

For reducing the diameter of any axially limited part of a metal tube, that part is heated externally by an annular heater while at least the adjacent part or parts of the metal tube are being cooled and held at a temperature sufficiently low to limit the free thermal expanison of the heated part. On cooling, the part that has been heated becomes less in diameter than the other portions of the metal tube. The complete length of the metal tube can likewise be reduced in diameter by moving the annular heater and the metal tube relative to each other in the longitudinal direction of the tube from one end to the other while at least the adjacencies of the part being heated are being cooled as by water. The same method is adaptable for the fabrication of wear-resistant dual wall pipe for the transportation of fluids, as is also disclosed herein.

Thermoplastic method of reducing the diameter of a metal tube

Growing community of inventors

Tokyo, Japan

Eisuke Mori