Kabushiki Kaisha Toshiba

Kioxia Corporation

Rion Company Ltd.

Eishi Shiobara

Shinichi Ito

Daisuke Kawamura

Yasunobu Onishi

Kei Hayasaki

Kenji Kawano

Kentaro Matsunaga

Yasuhiko Sato

Takehiro Kondoh

Hirokazu Kato

Tomoyuki Takeishi

Seiro Miyoshi

Yoshihisa Kawamura

Tomoya Oori

Yoshihiko Nakano

Hisataka Hayashi

Tokuhisa Ohiwa

Shuji Hayase

Junko Ohuchi

Hiroshi Tomita

Kazuya Fukuhara

Yuji Kobayashi

Tetsuro Nakasugi

Ikuo Yoneda

Tadahito Fujisawa

Hiroko Nakamura

Keisuke Kikutani

Motoyuki Sato

Tatsuhiko Higashiki

Kenji Chiba

Masaki Narita

Hidekazu Hayashi

Hideto Matsuyama

Rikako Kani

Kazuyuki Yahiro

Sawako Yoshikawa

Kaoru Kondo

Yukiko Kikuchi

Takuya Tabuchi

Koutarou Sho

Kazuna Bando

Sota Kondo

Yukiko Sato

According to one embodiment, a reflective mask comprises a reflection layer including a first region having a plurality of first patterns, a second region surrounding the first region, and a third region within the second region. The reflection layer includes a stack of alternating first layers and second layers. An absorber film covers the second region and has a second pattern that includes an opening exposing a portion of the third region. In some examples, the third region can include a plurality of third patterns therein.

Reflective mask

According to one embodiment, a particle measuring method is disclosed. The method includes irradiating a detection liquid with light. The detection liquid contains methyl salicylate. The method further includes converting scattered light from the detection liquid into an electric signal by using photoelectric conversion after irradiating the detection liquid with the light. The method further includes performing a particle measurement on the detection liquid by using the electric signal.

Particle measuring method and detection liquid

According to one embodiment, a management method of a manufacturing apparatus of a semiconductor device, the method includes measuring a weight of a pre-exposure substrate including a semiconductor substrate and a resist film provided on the semiconductor substrate, performing an exposure process for the resist film, measuring a weight of a post-exposure substrate including the semiconductor substrate and the resist film after the exposure process is performed, and acquiring a weight difference between the weight of the pre-exposure substrate and the weight of the post-exposure substrate.

Manufacturing apparatus of semiconductor device and management method of manufacturing apparatus of semiconductor device

According to one embodiment, a method of manufacturing a semiconductor device, includes forming an energy-ray-curable resin layer containing a sensitizer for increasing sensitivity to exposure light, on an underlayer region including a semiconductor substrate, irradiating the energy-ray-curable resin layer with energy rays to form a lower layer film containing the sensitizer, forming a resist film on the lower layer film, diffusing the sensitizer from the lower layer film into the resist film by thermal treatment, irradiating the resist film in which the sensitizer is diffused with exposure light, and developing the resist film irradiated with the exposure light.

Semiconductor device and method of manufacturing the same

According to one embodiment, a method is disclosed for forming a pattern. The method can include forming a resist film above a subject. The resist film includes a photosensitive material. The resist film has a concentration profile having a concentration of the photosensitive material being higher on a side of a bottom of the resist film than on a side of a surface of the resist film. A portion of the resist film has a maximum concentration of the photosensitive material existing closer to the side of the bottom than a center of the resist film in a thickness direction. The method can include irradiating the resist film with a light from the side of the surface. The method can include developing the resist film after the resist film being irradiated with the light.

Method for forming pattern

According to one embodiment, a pattern forming method is disclosed. The method can include selectively providing a curing agent to a pattern in a template, contacting the template provided the curing agent to a substrate, irradiating the curing agent with light where the template and the substrate are contacted each other to harden the curing agent, demolding the template from the substrate to form a curing agent pattern on the substrate, and etching the substrate on a basis of the curing agent pattern.

Pattern forming method

According to one embodiment, a pattern formation method is disclosed. The method includes forming a plurality of regions on a foundation and the plurality of the regions correspond to different pattern sizes. The method includes separating each of a plurality of block copolymers from another one of the plurality of the block copolymers and segregating the each of the plurality of the block copolymers into a corresponding one of the regions. The method includes performing a phase separation of the each of the block copolymers of each of the regions. The method includes selectively removing a designated phase of each of the phase-separated block copolymers to form a pattern of the each of the block copolymers and the pattern has a different pattern size for the each of the regions.

Pattern formation method and method for manufacturing semiconductor device

An imprint method includes applying a light curable resin on a substrate to be processed, the substrate including first and second regions on which the light curable resin is applied, contacting an imprint mold with the light curable resin, curing the light curable resin by irradiating the light curable resin with light passing through the imprint mold, generating gas by performing a predetermined process to the light curable resin applied on a region of the substrate, the region including at least the first region, wherein an amount of gas generated from the light curable resin applied on the first region is larger than an amount of gas generated from the light curable resin of the second region, and forming a pattern by separating the imprint mold from the light curable resin after the gas being generated.

Imprint method

A method of manufacturing a semiconductor device according to one embodiment, includes: forming a first mask material film on a workpiece film formed on a semiconductor substrate; forming a resist pattern on the first mask material film; forming a second mask material film having a desired film thickness on the first mask material film so as to cover the resist pattern; carrying out etchback of the second mask material film so as to expose the resist pattern and the first mask material film; processing the resist pattern and the first mask material film simultaneously which are exposed, while leaving the second mask material film of which etchback is carried out; and processing the workpiece film which exposes under the first mask material film.

Method of manufacturing a semiconductor device

Provided is a method of forming a resist pattern capable of forming a resist pattern, whose dimensional variations and defects are reduced as far as possible, with a high throughput. The invention provides a method of forming a resist pattern involving the following: forming a resist film on a substrate; subjecting the resist film to exposure treatment in a pressure-reduced condition after performing pressure-reducing treatment; performing reduced-pressure releasing treatment that releases the resist film from a pressure-reduced condition while humidifying the resist film by introducing a humidity-adjusted gas into the pressure-reduced environment; performing bake treatment that heats the resist film after the reduced-pressure releasing treatment; and developing the resist film.

Method of forming resist pattern

A template having a first recess pattern is brought into contact with a mask material formed on a substrate. The mask material with which the first recess pattern is filled is cured. A mask material pattern is formed on the substrate by releasing the template from the mask material. A resist pattern is formed to cover a part of the mask material pattern by forming a resist on the mask material pattern and selectively irradiating radiation onto the resist and thereafter developing the resist. The substrate is processed by using the mask material pattern and the resist pattern as a mask.

Method of manufacturing semiconductor device

A method of fabricating a semiconductor device according to an embodiment includes: forming a first resist pattern made of a first resist material on a workpiece material; irradiating an energy beam onto the first resist pattern, the energy beam exposing the first resist material to light; performing a treatment for improving resistance the first resist pattern after irradiation of the energy beam; forming a coating film on the workpiece material so as to cover the first resist pattern; and forming a second resist pattern made of a second resist material on the coating film after the treatment.

In the method for manufacturing a semiconductor device, a resist film is formed on a substrate and is processed to be provided with openings to form a first resist pattern. Additive-containing layers containing an additive that changes a state of the resist film to a soluble state for a developer are formed so as to cover the first resist pattern. A first resin film having a nature of changing to a soluble state for the developer by containing the additive is formed in the openings of the first resist pattern. The additive is diffused into the first resist pattern and the first resin film to form first and second additive-diffusing portions which can be solved in the developer. The first and second additive-diffusing portions are removed by the developer to form second resist pattern made of remaining portions in the first resist pattern and the first resin film.

Method for manufacturing semiconductor device

A method for evaluating chemical solution includes determining number of particles in liquid for each size of the particles by measurement, expressing a relationship between size of the particles and number of particles corresponding to the size by a function based on the number of particles for each size of the particles determined by the measurement, and evaluating influence of particles having size less than or equal to a measurement limit in the liquid based on the function.

Evaluation method for chemical solution, qualification method for chemical solution and method for manufacturing semiconductor device

A method for treating a substrate before exposing the substrate to which a resist is applied, includes, rinsing the substrate to which a resist is applied, and holding the rinsed substrate in an atmosphere. The atmosphere substantially contains no moisture until conveying the substrate to an exposure apparatus.

Method for treating substrate, method for conveying substrate, and apparatus for conveying substrate

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Yokohama, Japan

Eishi Shiobara