Fuji Xerox Co., Ltd.

Ebara Corporation

Kabushiki Kaisha Toshiba

Eisaku Hayashi

Kazuhiro Hayashi

Shinobu Ozeki

Masaru Kijima

Motoki Taniguchi

Akira Tateishi

Yoichi Kobayashi

Taro Takahashi

Itsuki Kobata

Takeshi Onishi

Isao Hayakawa

Noburu Shimizu

Yoshikuni Tateyama

Mitsuo Tada

Kunio Oishi

Daisuke Tatsumi

Shinrou Ohta

Tatsuya Kohama

Hidetaka Nakao

Hiromitsu Watanabe

Hiroyuki Sayuda

Kazushige Oi

Yoshiaki Miyake

Takeshi Ashihara

An information processing apparatus includes a selecting unit, a degree-of-association calculating unit, and a display. The selecting unit selects at least one of multiple components constituting electronic information. The degree-of-association calculating unit calculates the degree of association representing a strength of association between a different component associated with the component selected by the selecting unit and the selected component. The display displays associated-component information regarding the different component which is associated with the selected component, in a form based on the degree of association which is calculated by the degree-of-association calculating unit. When at least one of the components has a description indicating a conjunctive relation with the different component, the degree-of-association calculating unit associates the component with the different component.

Information processing apparatus and non-transitory computer readable medium

A data processing apparatus includes a display control unit that controls browsing document data to be displayed, the browsing document data being configured by plural browsing object data items, a position information acquisition unit that acquires position information, the position information being pointed by a pointing unit and indicating a position corresponding to the browsing document data displayed by the display control unit, a direction identification unit that identifies a direction pointed by the pointing unit, starting from the pointed position, based on a history of a motion by the pointing unit, and an attention data identification unit that identifies attention data indicating browsing object data that is focused, among the plural browsing object data items, based on the position information acquired by the position information acquisition unit and a direction identified by the direction identification unit.

Data processing system related to browsing

A photographing device includes a display that displays a screen, a photographing unit that is arranged on the same plane as the display, and a mirror that is arranged so that at least a portion of the display is capable of being photographed by the photographing unit.

Photographing device with a mirror to photograph a display

An apparatus polishes an object material such as a film on a substrate. This apparatus includes a polishing table for holding a polishing pad having a polishing surface, a motor configured to drive the polishing table, a holding mechanism configured to hold a substrate having an object material to be polished and to press the substrate against the polishing surface, a dresser configured to dress the polishing surface, and a monitoring unit configured to monitor a removal amount of the object material. The monitoring unit is operable to calculate the removal amount of the object material using a model equation containing a variable representing an integrated value of a torque current of the motor when polishing the object material and a variable representing a cumulative operating time of the dresser.

Polishing apparatus and polishing method

A method for polishing a substrate having a metal film thereon is described. The substrate has metal interconnects formed from part of the metal film. The polishing method includes performing a first polishing process of removing the metal film, after the first polishing process, performing a second polishing process of removing the barrier film, after the second polishing process, performing a third polishing process of polishing the insulating film. During the second polishing process and the third polishing process, a polishing state of the substrate is monitored with an eddy current sensor, and the third polishing process is terminated when an output signal of the eddy current sensor reaches a predetermined threshold.

Polishing method

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Kanagawa, Japan

Eisaku Hayashi