Sumitomo Electric Industries, Limited

Nippon Soda Co., Ltd.

Sumitomo Electric Printed Circuits, Inc.

Eiko Imazaki

Koji Nitta

Shoichiro Sakai

Atsushi Fukunaga

Koma Numata

Kenji Takahashi

Shinji Inazawa

Kousuke Miura

Hirohisa Saito

Masahiro Matsumoto

Yoshio Oka

Hideki Matsuoka

Toshiaki Yamashita

Shigeaki Uemura

Hideaki Ito

Hitoshi Kobayashi

Ippei Tanaka

Takayuki Yonezawa

Shinichi Maruyama

A method of making a printed circuit board includes a step of providing a double-sided plate that is an insulating substrate having conductive layers on respective surfaces thereof, a first coating step of coating a first surface of the double-sided plate with a first photosensitive resin film, a second coating step of coating a second surface of the double-sided plate with a second photosensitive resin film, a first exposure step of exposing the photosensitive resin film coating the first surface after the first and second coating steps, and a second exposure step of exposing the photosensitive resin film coating the second surface after the first exposure step, wherein a maximum depth of a depression in an outermost surface of the second photosensitive resin film used in the second exposure step is less than 1.0 &#x3bc;m.

Method of making printed circuit board and laminated structure

A printed circuit board according to an embodiment of the present disclosure includes a base film having an insulating property, and a conductive pattern that is stacked on at least one surface of the base film and that includes a plurality of wiring parts arranged in parallel. The plurality of wiring parts have an average width of 5 &#x3bc;m or more and 15 &#x3bc;m or less. The plurality of wiring parts have an electroless plating layer and an electroplating layer stacked on the electroless plating layer. A void density at an interface between the electroless plating layer and the electroplating layer in a section of the plurality of wiring parts in a thickness direction is 0.01 &#x3bc;m/&#x3bc;m or less.

Printed circuit board and method for manufacturing printed circuit board

A printed circuit board according to one embodiment of the present invention is a printed circuit board including a plate-shaped or a sheet-shaped insulating material having a penetrating hole, and a metal plating layer layered on both surfaces of the insulating material and an inner peripheral surface of the insulating material, wherein an inner diameter of the penetrating hole monotonically decreases from a top surface of the insulating material toward a back surface, and wherein the inner diameter of the penetrating hole at a center in a thickness direction of the insulating material is smaller than an average of an opening diameter on the top side and an opening diameter on the back side.

Printed circuit board and method of manufacturing a printed circuit board

A printed wiring board includes an insulator having a first surface, and a second surface opposite to the first surface, a through-hole penetrating from the first surface to the second surface, and a metal plated layer formed on the first and second surfaces of the insulator, and on an inner peripheral surface of the through-hole, wherein an inside diameter of the through-hole gradually decreases from the first surface toward the second surface of the insulator. An average diameter of the through-hole is 20 &#x3bc;m or greater and 35 &#x3bc;m or less at the first surface, and is 3 &#x3bc;m or greater and 15 &#x3bc;m or less at the second surface, and an average thickness of the metal plated layer formed on the first and second surfaces is 8 &#x3bc;m or greater and 12 &#x3bc;m or less.

Printed wiring board and method for manufacturing printed wiring board

Provided is a method for producing a negative electrode for an electric storage device, the method comprising the steps of preparing a negative electrode composition comprising a negative electrode active material that reversibly carries a sodium ion, metal sodium, and a liquid dispersion medium for dispersing them; allowing a negative electrode current collector to hold the negative electrode composition; evaporating at least part of the liquid dispersion medium from the negative electrode composition held by the negative electrode current collector, thereby giving a negative electrode precursor comprising the negative electrode active material, the metal sodium, and the negative electrode current collector; and bringing the negative electrode precursor into contact with an electrolyte having sodium ion conductivity, thereby doping the negative electrode active material with sodium eluted from the metal sodium.

Negative electrode composition for electric storage device, negative electrode including the composition, electric storage device, and method for producing negative electrode for electric storage device

A positive electrode for a sodium ion secondary battery includes a positive electrode active material that intercalates and deintercalates sodium ions, a conductive assistant, a binder, and a carboxylic acid, the binder containing a vinylidene fluoride-based polymer, the carboxylic acid having at least one of a boiling point and a thermal decomposition point, and whichever of the boiling point and the thermal decomposition point is lower being higher than 150&#xb0; C. The carboxylic acid is preferably at least one selected from the group consisting of hydroxy acids and polycarboxylic acids.

Positive electrode for sodium ion secondary battery and sodium ion secondary battery

An aspect of the present invention relates to a negative electrode for a sodium molten salt battery, the negative electrode including a negative electrode current collector and a negative electrode mixture layer arranged on a surface of the negative electrode current collector, the negative electrode mixture layer including negative electrode active material particles and a film arranged on a surface of each of the negative electrode active material particles, the negative electrode active material particles containing hard carbon, and the film containing a sodium-containing sulfide.

Negative electrode for sodium molten salt battery, method for producing same, and sodium molten salt battery

Provided is an electrode for a sodium molten-salt battery in which degradation of the electrode can be suppressed even when charging and discharging are repeated, and which has excellent cycle characteristics. The electrode for a sodium molten-salt battery includes a current collector and an electrode mixture adhering to a surface of the current collector, in which the electrode mixture includes an electrode active material and a binder containing a polymer, and the polymer does not contain a fluorine atom. The polymer can include, for example, at least one selected from the group consisting of polyamide resins and polyimide resins or at least one selected from the group consisting of acrylic resins, rubber-like polymers, and cellulose derivatives.

Electrode for sodium molten-salt battery and sodium molten-salt battery

Provided is a sodium molten-salt battery having good charge-discharge cycle characteristics. The sodium molten-salt battery includes a positive electrode that contains a positive electrode active material, a negative electrode that contains a negative electrode active material, and a molten-salt electrolyte that contains a sodium salt and an ionic liquid that dissolves the sodium salt. The negative electrode active material contains non-graphitizable carbon. The ionic liquid is a salt of a bis(sulfonyl)imide anion and a first onium cation that does not cause a Faradaic reaction with the non-graphitizable carbon. The molten-salt electrolyte contains a second onium cation in an amount of 1,000 ppm by mass or less. The second onium cation is represented by a general formula (1): RRRRNwhere Rto Rare each independently a hydrogen atom or a methyl group.

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Osaka, Japan

Eiko Imazaki