Tokyo Electron Limited

Eiki Endo

Tatsuya Ogi

Tatsuya Mukoyama

Hiroyuki Takatsuka

A substrate processing apparatus includes: a substrate processing part including a load port configured to place thereon a substrate accommodating vessel in which at least one substrate is accommodated, and configured to take out the at least one substrate from the substrate accommodating vessel and to perform a series of processes on the at least one substrate; and a controller configured to control an opening and closing of a lid of the substrate accommodating vessel, wherein the controller performs control to open the lid after the substrate accommodating vessel is placed on the load port, and the controller performs control to close the lid when an abnormality occurs in the substrate processing part and when none of the at least one substrate removed from the substrate accommodating vessel can be recovered to the substrate accommodating vessel after a predetermined period of time from the occurrence of the abnormality.

Substrate processing apparatus and method of opening/closing lid of substrate accommodating vessel

There is provided a substrate transfer method capable of preventing fine particles from adhering to a wafer. A substrate processing systemincludes process modulestoeach having therein an inner space S; a transfer module, having an inner space S, connected to the process modulesto; and opening/closing gate valveseach partitioning the inner space Sand the inner space S. The transfer moduleincludes in the inner space Sa transfer arm devicefor holding a wafer W and for loading/unloading the wafer W into/from the process modulesto. The transfer arm deviceholds the wafer W at a retreated position deviated from a facing position facing the gate valveduring an opening motion of the gate valve

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Miyagi, Japan

Eiki Endo