3m Innovative Properties Company

Eike H Klünker

Petra M Stegmaier

Pierre Reinhard Bieber

Rudolf J Dams

Jingjing Ma

Michele A Craton

Zhong Chen

Siegfried Rainer Goeb

George J Clements

Shijing Cheng

Jeffrey M Imsande

Rudy W Van Campenhout

Matthias Conradi

Dmitri D Iarikov

John W McAllister

Niklas M Matzeit

The present disclosure relates to a process of manufacturing a pressure sensitive adhesive, comprising the steps of: a) providing a hot melt mixing apparatus comprising a reaction chamber; b) providing a hot melt processable pressure sensitive adhesive composition comprising: (1) a (meth)acrylate copolymer component comprising: i. C1-C32 (meth)acrylic acid ester monomer units; ii. optionally, ethylenically unsaturated monomer units having functional groups selected from the group consisting of acid, hydroxyl, acid anhydride, epoxide, amine, amide groups, and any combinations thereof; and iii. optionally, further ethylenically unsaturated monomer units which are copolymerizable with monomer units (i) and/or (ii); and (2) a crosslinking system selected from the group consisting of thermal crosslinking systems, actinic radiation crosslinking systems, and any combinations thereof; (3) optionally, at least one expandable microsphere; and (4) optionally, at least one pigment; c) providing a polymeric resin; d) subjecting the polymeric resin to a heating step (thereby at least partly remove low Volatile Organic Compounds (VOC) from the polymeric resin) thereby forming a cleaned polymeric resin; e) incorporating the cleaned polymeric resin and the hot melt processable pressure sensitive adhesive composition in the reaction chamber of the hot melt mixing apparatus; −57-f) mixing the hot melt processable pressure sensitive adhesive composition and the cleaned polymeric resin in the hot melt mixing apparatus thereby forming a hot melt blend; g) removing the hot melt blend from the hot melt mixing apparatus; and h) optionally, crosslinking the hot melt blend.

Process of manufacturing a pressure sensitive adhesive having a low VOC characteristics

The present disclosure relates to an electronic device comprising at least one organic light-emitting diode and a pressure sensitive adhesive composition comprising a synthetic rubber block (co)polymer, and wherein the pressure sensitive adhesive composition has: a) a relative permittivity no greater than 2.50, when measured at an alternating current frequency of 100 kHz according to the test method described in the experimental section; b) a water uptake no greater than 0.60 wt %, when measured after exposure to 60&#xb0; C. and 95% relative humidity for 120 hours, according to the test method described in the experimental section; and c) optionally, a peel adhesion value above 0.20 N/mm, when measured at 85&#xb0; C. according to the test method described in the experimental section. In another aspect, the present disclosure is directed to a method of manufacturing an electronic device comprising at least one organic light-emitting diode, wherein the method comprises the step of using a pressure sensitive adhesive composition as described above. According to still another aspect, the present disclosure is directed to the use of a pressure sensitive adhesive composition as described above for protecting organic light-emitting devices or organic light-emitting diodes from moisture and air permeation.

Pressure-sensitive adhesive compositions for manufacturing electronic devices

The present disclosure relates to a process for the manufacturing of a compound comprising a (meth)acryloyl group, wherein the process comprises the steps of: a) providing a multi-screw extruder comprising a reaction chamber; b) providing reactants and reagents comprising: i. an alcohol or a primary or secondary amine; ii. a base; and iii. a (meth)acryloyl halide or a 3-halopropionyl halide; and c) incorporating the reactants and reagents into the reaction chamber of the multi-screw extruder, thereby forming a reaction product stream comprising the compound comprising a (meth)acryloyl group.

Process for the manufacturing of a compound comprising a (meth)acryloyl group

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Kaarst, Germany

Eike H Klünker