Fujifilm Corporation

Eijiro Iwase

Akihito Fukunaga

Koji Tonohara

Takehiko Nakayama

Koichi Sato

Akihiko Suyama

Kyohisa Uchiumi

Yasuhiro Sekizawa

Jiro Tsukahara

Takashi Yonemoto

Hiroki Sugiura

Kenji Ichikawa

Katsuyuki Nukui

Keio Okano

Yasushi Kikuchi

A method of manufacturing a formed body for an electrode including: a step of jetting an electrode material containing an electrode active material from an outlet toward a surface Fof a first support while relatively moving the outlet jetting the electrode material and the first support in a plane direction of the first support, in which in the step, a contact member having a contact surface Fthat is brought into contact with the electrode material is used, and in a case where a wall friction angle between the contact surface Fof the contact member and the electrode material is denoted by θ1, and a wall friction angle between the surface Fof the first support and the electrode material is denoted by θ2, a relationship (1) 1°≤θ1<15° and a relationship (2) 15°≤θ2 are satisfied.

Method of manufacturing formed body for electrode

The present disclosure provides a method of manufacturing a formed body for an electrode including: a step of preparing an electrode material containing an electrode active material; a step of supplying the electrode material onto the support; and a step of pressurizing the electrode material on the support by sandwiching the support and the electrode material between a first roll that is brought into contact with the electrode material and a second roll that is brought into contact with the support, in which a temperature T1 of the first roll and a temperature T2 of the second roll satisfy a relationship T1>T2.

An object of the present invention is to provide a film forming method for an organic semiconductor film, with which an organic semiconductor film having good uniformity and high mobility can be manufactured with good productivity. A coating liquid is prepared by dissolving an organic semiconductor material in a solvent, the coating liquid is sprayed by a spray unit, and the coating liquid is applied onto a temperature-controlled substrate while the coating liquid during the flight which has been sprayed by the spray unit is being heated, whereby problems are solved.

Film forming method for organic semiconductor film

The present disclosure provides a method of manufacturing a formed body for an electrode including: a step of preparing an electrode material containing an electrode active material; a step of forming at least two projecting portions containing the electrode material and placed side by side on a support in a width direction of the support by supplying the electrode material onto the support; and a step of leveling the projecting portions on the support.

A method of manufacturing a formed body for an electrode includes a first step of dropping an electrode material containing an electrode active material into a gap between a pair of transport belts and introducing the electrode material between transport surfaces of the pair of transport belts; a second step of belt-transporting and pressurizing the introduced electrode material with the pair of transport belts; and a third step of transferring the electrode material after the belt transporting and the pressurization, on a deposition belt, in which a transport direction in a transport, passage through which the electrode material is transported, of the deposition belt intersects a transport direction in a transport passage, through which the electrode material is transported, of the pair of transport belts.

The present disclosure provides a method of manufacturing a formed body for an electrode comprising in order: a step of preparing an electrode material containing an electrode active material; a step of supplying the electrode material to a forming mold which has a frame-shaped side wall portion defining a space portion accommodating the electrode material and has a first support placed on a bottom surface of the forming mold; a step of forming the electrode material along an internal shape of the forming mold; and a step of taking out the electrode material from the forming mold.

An object is to provide a spray coating device and a coating method, with which a uniform coating film can be formed by spray coating with two liquids having reactivity, and in which precipitation of a reaction product on a periphery can also be prevented. The object is achieved by providing a transporting unit for transporting a substrate downward; a first spray nozzle; a second spray nozzle disposed below the first spray nozzle; a holding plate for holding the first spray nozzle and the second spray nozzle such that an angle formed by center lines of the first spray nozzle and the second spray nozzle is 5° to 150°; and a liquid film forming unit for forming a liquid film which flows from above to below on a surface of the holding plate.

Spray coating device and spray coating method

A metal pattern forming method has: producing a first base having a pattern of lyophilic portions which have lyophilic properties with respect to a liquid containing a metal component and liquid-repellent portions which have liquid-repellent properties with respect to the liquid containing a metal component; producing a second base which holds the liquid containing a metal component; and transferring the liquid containing a metal component from the second base to the lyophilic portions of the first base by bringing the first base and the second base into contact with each other. With the metal pattern forming method, it is possible to form a metal pattern with high accuracy in which the metal is prevented from adhering to an unnecessary position on the base.

Metal pattern forming method

An object is to coat a target position on a substrate with a dense film. In order to achieve the object, while a substrate on which a base containing a coating material is formed is transported, an auxiliary agent is applied to the substrate, and then a main agent containing a coating material is applied to the substrate to react the main agent with the auxiliary agent, so that a portion on the substrate where the base is formed is coated with the coating material.

Coating method

An object of the present invention is to provide a spray device that can separately apply a coating liquid, and can form a dense organic substance film having high uniformity, and a spray coating method. To achieve the object, the spray device includes: a spray; an air flow forming unit that forms an air flow for restricting a flying space of a coating liquid sprayed by the spray; and a space heating unit that heats the flying space of the coating liquid from outside of the air flow formed by the air flow forming unit.

Spray device and spray coating method

Provided are an organic thin film transistor having high bendability and high stability in air and a method of manufacturing the organic thin film transistor. The organic thin film transistor includes: a gas barrier layer consisting of a resin layer and an inorganic layer; a transistor element that is formed on one main surface side of the gas barrier layer and includes a gate electrode, an insulating film, an organic semiconductor layer, a source electrode, and a drain electrode; and a sealing layer that is laminated on a side of the transistor element opposite to the gas barrier layer through an adhesive layer, in which a thickness of the resin layer in the gas barrier layer is less than a thickness ranging from the inorganic layer to the sealing layer in the gas barrier layer.

Organic thin film transistor and method of manufacturing organic thin film transistor

A method of manufacturing a formed body for an electrode includes: preparing an electrode material; placing a shape retaining member having an rectangular tubular shape with one opening portion L thereof facing down, and supplying the electrode material into the shape retaining member from the other opening portion M thereof; and discharging the electrode material onto a support from the opening portion L while relatively moving the opening portion L and the support, to form a film, a bulk density Dof the electrode material in the first step and a bulk density Dof the electrode material at the opening portion L satisfying a relationship of D/D=1.1 to 30, and a width Tof the opening portion L in a short side direction and a distance Tbetween the end portion X of the opening portion L and the support satisfying a relationship of width T&#x3e;distance T.

A gas barrier film includes a substrate, a peeling resin layer from which the substrate can be peeled off, one or more inorganic layers, and an adhesive layer provided on an inorganic layer most spaced from the substrate, in which an inorganic layer is provided on a surface of the peeling resin layer, the peeling resin layer is a resin layer including a phenyl group, and the adhesive layer is solid at normal temperature and has fluidity by heating, thereby exhibiting adhesiveness.

Gas barrier film, optical element including gas barrier film, and method for producing gas barrier film

A gas barrier film has, in sequence, a support, an inorganic layer disposed on one surface side of the support, an adhesive layer disposed on a surface of the inorganic layer, and a resin layer disposed on a surface of the adhesive layer in which the adhesive layer has a thickness of 15 &#x3bc;m or less, and the adhesion strength between the inorganic layer and the adhesive layer is 21 N/25 mm or more and 60 N/25 mm or less. A method for producing a gas barrier film includes an inorganic layer deposition step and a bonding step in a vacuum.

Gas barrier film and method for producing gas barrier film

A gas barrier film has, in sequence, a support, an inorganic layer, and a resin film, the inorganic layer and the resin film being supported on the support. The resin film has a hydroxy group. The inorganic layer and the resin film are directly joined to each other with separate portions that are partially present at an interface between the inorganic layer and the resin film. The gas barrier film has one or more sets of a combination of the inorganic layer and the resin film. A method for producing the gas barrier film includes forming an inorganic layer by a gas-phase deposition method, subsequently laminating a resin film having a hydroxy group with the inorganic layer, and heating the resulting film laminate.

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Kanagawa, Japan

Eijiro Iwase