Nitto-denko Corporation

Eiji Toyoda

Makoto Namikawa

Yoshio Terada

Ryoma Yoshioka

Naoya Sugimoto

Takashi Oda

Kosuke Morita

Jirou Nukaga

Yusaku Shimizu

Masayuki Yamamoto

Goji Shiga

Keisuke Okumura

Hiroshi Noro

Shotaro Masuda

Kazuhiro Ikemura

Takuji Okeyui

Saburo Miyamoto

Takao Matsushita

Daisuke Uenda

Shigeji Kuroda

Tsuyoshi Ishizaka

Haruo Ioka

Takuya Eto

Takeshi Matsumura

Jun Ishii

Hiroshi Yamazaki

Naohide Takamoto

Hirofumi Fujii

Seiichiro Shirai

Hitoshi Ishizaka

Keisuke Yoshikawa

Yasuhiro Amano

Shinya Akizuki

Daisuke Tsukahara

Takahiro Uchida

Kouichi Hashimoto

Satoshi Sakai

Mitsuaki Fusumada

Chie Iino

Keiji Takemura

Yu Tachikawa

Nobuaki Maruoka

Katsuyuki Nakabayashi

Toshihiko Onozuka

Shigeyasu Mori

Asami Funatsu

Kojiro Kameyama

Hajime Sunahara

Takeshi Okada

Kei Toyota

Tsuyoshi Torinari

Seiichirou Shirai

Takayuki Noishiki

Katsuhiro Sasajima

Shigetomi Kido

The electrically conductive composition includes an electrical conductive polymer, a binder resin, and at least one of a cross-linking agent and a plasticizer.

Electrically conductive composition and biosensor

A laminate patchable to a living body and that includes a pressure-sensitive adhesive layer for patching to the living body, a substrate layer disposed on a one-side surface in a thickness direction of the pressure-sensitive adhesive layer and supporting the pressure-sensitive adhesive layer, and a protecting layer disposed on a one-side surface in the thickness direction of the substrate layer.

Laminate patchable to living body

A patchable biosensor includes a substrate extending in a longitudinal direction and being stretchable for being patched to a surface of a living body and an electronic component disposed on a one-side surface in a thickness direction of the substrate and extending in the longitudinal direction. The longitudinal direction of the electronic component crosses the longitudinal direction of the substrate.

Patchable biosensor

A laminate patchable to a living body and that includes a pressure-sensitive adhesive layer for patching to the living body and a substrate layer disposed on a one-side surface in a thickness direction of the pressure-sensitive adhesive layer and supporting the pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer contains a first carboxylic acid ester and the substrate layer contains a second carboxylic acid ester.

A method for producing a wired circuit board includes a step (1) of forming a seed layer on one surface in a thickness direction of a peeling layer, a step (2) of forming a conductive pattern on one surface in the thickness direction of the seed layer, a step (3) of covering the seed layer and the conductive pattern with an insulating layer, a step (4) of peeling the peeling layer from the seed layer, and a step (5) of removing the seed layer. The insulating layer has the number of times of folding endurance measured in conformity with JIS P8115 (2001) of 10 times or more.

Producing method of wired circuit board

Provided are a resin sheet, for sealing an electronic device, which is not easily shifted out of position; and a method for manufacturing an electronic-device package. This resin sheet, for sealing an electronic device, has a probe tack of 5 to 500 g at 25&#xb0; C. The tack is measured, using a probe having a diameter of 25 mm.

Resin sheet for sealing electronic device and method for manufacturing electronic-device package

A wired circuit board includes an insulating layer and a conductive pattern embedded in the insulating layer. The conductive pattern has an exposed surface exposed from one surface in a thickness direction of the insulating layer and the insulating layer has the number of times of folding endurance measured in conformity with JIS P8115 (2001) of 10 times or more.

Wired circuit board

The present invention provides a thermally curable resin sheet for sealing a semiconductor chip having excellent reliability and storability while being reduced in warpage deformation due to the volume shrinkage of the thermally curable resin sheet, and a method for manufacturing a semiconductor package. The present invention relates to a thermally curable resin sheet for sealing a semiconductor chip, wherein an activation energy (Ea) satisfies the following formula (1), a glass transition temperature of a product thermally cured at 150&#xb0; C. for 1 hour is 125&#xb0; C. or higher, and a thermal expansion coefficient &#x3b1; [ppm/K] of the thermally cured product at the glass transition temperature or lower and a storage modulus E' [GPa] at 25&#xb0; C. of the thermally cured product satisfy the following formula (2):30&#x2266;&#x2266;120 [kJ/mol]&#x2003;&#x2003;(1); and10,000&#x2266;&#x3b1;&#xd7;&#x2032;&#x2266;300,000 [Pa/K]&#x2003;&#x2003;(2).

Thermally curable resin sheet for sealing semiconductor chip, and method for manufacturing semiconductor package

A mobile terminal power receiving modulewhich is housed together with a rechargeable batteryin a rechargeable battery packin a mobile terminal such as a smart phone, includes a sheet coilin which a coilconstituted by conductors is formed on a flexible circuit boardas a circuit pattern and a magnetic sheetmade of resin in which magnetic powder is dispersed.

Mobile terminal power receiving module utilizing wireless power transmission and mobile terminal rechargeable battery including mobile terminal power receiving module

A thermosetting resin sheet for sealing an electronic component, that is excellent in adhesiveness, onto the electric component; a resin-sealed type semiconductor device high in reliability; and a method for producing the device are provided. The present invention relates to a thermosetting resin sheet for sealing an electronic component, comprising one or more resin components, one of the components being allowable to be a thermoplastic resin, and having a content by percentage of the thermoplastic resin of 30% or less by weight of all of the entire resin components.

Thermosetting resin sheet for sealing electronic component, resin-sealed type semiconductor device, and method for producing resin-sealed type semiconductor device

A label sheet for cleaning is formed of a label for cleaning including a cleaning layer having a 180&#xb0; peeling adhesion to a silicon wafer of 0.20 N/10 mm or less after receiving an active energy and an adhesive layer provided on one of surfaces of said cleaning layer, and a separator on which the label is removably provided through the adhesive layer.

Label sheet for cleaning and conveying member having cleaning function

A method for manufacturing an electronic parts device allowing for easy overmolding and underfilling without requiring a jig for preventing leakage of the melted resin composition, and a resin composition sheet for electronic parts encapsulation used therein.

Method for manufacturing electronic parts device and resin composition for electronic parts encapsulation

A thermosetting encapsulation adhesive sheet which is used for encapsulating a chip type device () having connection electrodes (bumps) () and mounted on a wiring circuit board (). The thermosetting encapsulation adhesive sheet is composed of an epoxy resin composition having a viscosity of 5&#xd7;10to 5&#xd7;10Pa&#xb7;s as measured at a temperature of 80 to 120&#xb0; C. before thermosetting thereof. The thermosetting encapsulation adhesive sheet makes it possible to conveniently encapsulate a hollow device with an improved yield.

Thermosetting encapsulation adhesive sheet

Provided are a sealing resin sheet, wherein a clean, smooth and flat ground surface is obtained by grinding after resin sealing, a method for producing an electronic component package using the same, and an electronic component package obtained by the production method. The present invention provides a sealing resin sheet, wherein a ground surface has a mean surface roughness Ra of 1 &#x3bc;m or less when grinding is performed under conditions of a grind bite peripheral velocity of 1000 m/minute, a feed pitch of 100 &#x3bc;m and a cut depth of 10 &#x3bc;m after a heat curing treatment is performed at 180&#xb0; C. for 1 hour; and a Shore D hardness at 100&#xb0; C. after the heat curing treatment is 70 or more.

Sealing resin sheet, method for producing electronic component package and electronic component package

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Ibaraki, Japan

Eiji Toyoda