Hitachi, Ltd.

Hitachi Metals, Ltd.

Hitachi Kyowa Engineering Co., Ltd.

Eiji Sakamoto

Shohei Hata

Naoki Matsushima

Ippei Kono

Atsushi Kazama

Takanori Aono

Ryoji Okada

Hideaki Takemori

Koji Utsumi

Masatoshi Seki

Toshiki Kida

Kohei Kaiho

The present invention provides a technology for generating an NC program which can secure appropriate machining accuracy. Provided is a conversion computerwhich includes a CPUand generates an NC program for a turning process for a workpiece on a lathe, wherein the CPUis configured to generate an NC program such that displacements caused for a workpiece to be processed on a plurality of machining positions at a time of a turning process are calculated, on the basis of the displacements caused for the workpiece on the plurality of machining positions, a movement path of a tool to be used at the time of the turning process is decided, and the tool is moved through the decided movement path.

NC program generation system and NC program generation method

The present invention makes it possible to convert an NC program used for one processing into an NC program capable of securing appropriate processing accuracy in another processing machine. Provided is an NC program conversion process method by a conversion system which converts a conversion source NC program for executing a processing in a conversion source processing machine into a conversion destination NC program for executing a processing in a conversion destination processing machine, wherein an input of information relating to (1) stiffness of the conversion destination processing machine or (2) stiffness of the tool included in a conversion destination toolset is received, and on the basis of the received information relating to the stiffness, a conversion source NC programis converted into a conversion destination NC program

NC program conversion process method and processing treatment system

Submounts for mounting optical devices which have an excellent heat radiating property and can be formed in a wafer state in batch are provided. A metallized electrode including optical device mounting parts and wiring parts is formed on a surface of a first substrate containing an insulating material as a main component, a through hole is formed in a glass substrate serving as a second substrate, the optical device mounting parts of the first substrate are aligned to be located inside the through hole of the second substrate, and the first substrate and the second substrate are joined together by use of a method such as anodic bonding.

Submount for optical device and its manufacturing method

A bonding structure that a bonding region can endure a high temperature environment and the bonding can be maintained with high reliability is provided as a bonding material capable of maintaining reliable bonding in high temperature environment in place of solder including Pb. In the bonding structure for a first member and a second member, solder and glass are used to bond the first member and the second member together and the glass seals the solder. Thereby, electrical conductivity is ensured and the outflow of melting solder in high temperatures can be inhibited to improve the durability.

Bonding structure and method for manufacturing same

The present invention provides a low-cost MEMS functional device by improving air tightness of a jointed section by anode junction in wafer level packaging for MEMS based functional devices. The MEMS functional device comprises a function element section formed by processing a substrate mainly made of Si, a metallized film for sealing formed around the functional element, and a glass substrate jointed to the metallized film for sealing by anode junction. Formed on a surface of the metallized film for sealing is a metallized film containing at least one of Sn and Ti as a main component.

Functional device

A packaging structure for hermetically sealing a functional device by solder connection at a wafer level in which a first Si substrate having a concave portion metallized on its internal surface and a second Si substrate metallized at a position opposed to said concave portion are used, the metallization applied to the internal surface of the concave portion of the first Si substrate and the metallization applied to the second Si substrate at the position opposed to the concave portion are connected by molten solder to hermetically seal the functional device between the first Si substrate and the second Si substrate, whereby the wettability of the solder for the two Si substrates is improved, the bondability between the Si substrates is enhanced, and the yield at which the package is manufactured is improved.

Growing community of inventors

Fujisawa, Japan

Eiji Sakamoto