Hitachi Chemical Company, Ltd.

Hitachi, Ltd.

Eiji Omori

Yoshiyuki Mukoyama

Fumio Nakano

Seikichi Tanno

Iwao Maekawa

Isao Uchigasaki

Hideyuki Tobita

Mineo Nakano

Yuji Aimono

Hatuo Sugitani

Ren Ito

Yuuji Aimono

Naoki Yokoyama

A coating composition comprising (A) a thermoplastic resin having a glass transition temperature of 0.degree. to 80.degree. C., (B) a compound having 2 or more hydroxyl groups in the molecule, (C) a thixotropic agent and (D) a solvent, and said coating composition having a viscosity of 3 to 50 poises at 25.degree. C. and a thixotropy of 2 or more can give a moistureproof insulating coating film with uniform and large thickness and very few bubbles by one-time treatment over packing circuit boards.

Moistureproof insulating coating composition for packing circuit boards

A resinous composition comprising (a) a low-odor crosslinkable monomer obtained by reacting a glycidyl ester of synthetic or vegetable oil fatty acid with acrylic acid or methacrylic acid with heating, and (b) a polybutadiene modified by acrylic acid or methacrylic acid or an unsaturated polyester resin produces almost no or very little odor in the state of a varnish and at drying or curing. Said composition can produce varnishes excellent in mechanical and electrical properties.

Odorless or low-odor resinous composition

An unsaturated polyester resinous composition comprising (a) unsaturated polyester, (b) a crosslinkable monomer, (c) at least one compound selected from the group consisting of 1,2,4-triazole and its derivatives, (d) a curing agent and (e) a manganese salt of organic acid as a curing accelerator is excellent in the adhesion to copper, the prevention of patina, air drying characteristics and stability of varnish.

Unsaturated polyester resinous composition

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Hitachi, Japan

Eiji Omori