Denso Corporation

Eiji Nomura

Takahisa Kaneko

Kuniaki Mamitsu

Masayoshi Nishihata

Hiroyuki Wado

Chikage Noritake

Toshiki Itoh

Masaya Tonomoto

Wataru Kobayashi

Eiji Hayashi

Kazuki Kouda

A semiconductor device includes: a semiconductor chip having an electrode on one surface; a first conductive member disposed on one surface side of the semiconductor chip; a metal member having a base member and a membrane and disposed between the semiconductor chip and the first conductive member; a first solder disposed between the electrode of the semiconductor chip and the metal member; and a second solder disposed between the metal member and the first conductive member. The membrane has a metal thin film arranged on the surface of the base member and an uneven oxide film. The uneven oxide film is arranged on the metal thin film in at least a part of a connection region of a surface of the metal member, the connection region connecting a first connection region to which the first solder is connected and a second connection region to which the second solder is connected.

Semiconductor device and method for manufacturing same

A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together.

Semiconductor device including cooler

Semiconductor package cooled by grounded cooler

Growing community of inventors

Kariya, Japan

Eiji Nomura